Method of Treating Food and Food Obtained by This Method

Abstract

A method of treating food capable of easily softening or pulverizing food in a short time without losing nutrients is provided. A shock wave (SW) generated in a shock wave source is applied to food such as an apple or tea leaves to soften or pulverize the food. A large mechanical load is not necessary, so the food is easily softened or pulverized. Moreover, it is not necessary to heat the food, so the food is softened or pulverized in a short time without losing nutrients in the food due to heat during heating.

1 . A method of treating food comprising a step of:
 softening food including fruits and vegetables by applying a shock wave with a pressure ranging from larger than 5 MPa to 500 MPa to the food.   
     
     
         2 . The method of treating food according to  claim 1 , wherein
 the food is softened while keeping the original shape of the food.   
     
     
         3 . The method of treating food according to  claim 1 , wherein
 the food is an apple, a pineapple, a wax gourd, a Japanese radish, ginger, a potato, a Chinese yam, a sweet potato, garlic, a tomato, a yuzu orange, a passion fruit, a dragon fruit, a burdock, a bamboo shoot, a prune, sugarcane or sugar beet.   
     
     
         4 . The method of treating food according to  claim 1 , wherein
 a shock wave is applied to food in contact with a liquid, thereby while the food is softened, the liquid is allowed to penetrate the food.   
     
     
         5 . The method of treating food according to  claim 1 , wherein
 after a shock wave is applied the food to soften the food, the food is compressed.   
     
     
         6 . The method of treating food according to  claim 1 , wherein
 after a shock wave is applied to the food to soften the food, a liquid is injected into the food.   
     
     
         7 . A method of treating food comprising a step of:
 pulverizing food including grains, beans and tea leaves by applying a shock wave with a pressure ranging from 1 MPa to 1 GPa both inclusive to the food.   
     
     
         8 . The method of treating food according to  claim 7 , wherein
 the food is tea leaves, azuki beans, coffee beans, a walnut, rice with 5 grains or a shiitake mushroom.   
     
     
         9 . Food including vegetables and fruits being subjected to a pressure ranging from larger than 5 MPa to 500 MPa by a shock wave, and being softened, compared to the food before being subjected to the pressure. 
     
     
         10 . The food according to  claim 9 , wherein
 the food keeps its original shape.   
     
     
         11 . Food including vegetables and fruits being subjected to a pressure ranging from larger than 5 MPa to 500 MPa by a shock wave, wherein
 the proportion of air bubbles is increased, compared to the food before being subjected to the pressure.   
     
     
         12 . Food including vegetables and fruits being subjected to a pressure ranging from larger than 5 MPa to 500 MPa by a shock wave, wherein
 the food includes cells with broken cell walls.   
     
     
         13 . Food including vegetables and fruits being subjected to a pressure ranging from larger than 5 MPa to 500 MPa by a shock wave, wherein
 the extraction ratio of a specific nutrient is increased, compared to the food before being subjected to the pressure.   
     
     
         14 . The method of treating food according to  claim 2 , wherein
 the food is an apple, a pineapple, a wax gourd, a Japanese radish, ginger, a potato, a Chinese yam, a sweet potato, garlic, a tomato, a yuzu orange, a passion fruit, a dragon fruit, a burdock, a bamboo shoot, a prune, sugarcane or sugar beet.