US2008169609A1PendingUtilityA1
Thermal signature target form
Est. expiryJan 17, 2027(~0.5 yrs left)· nominal 20-yr term from priority
Inventors:Jonathan M. Hetland
F41J 2/02F41J 7/04F41J 7/06Y10T29/4935
42
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Claims
Abstract
A three-dimensional molded thermal signature target form comprising a conductive polymer material suitable for conducting infrared radiation such that a thermal signature is created and viewable by any number of suitable IR imaging or viewing systems. The thermal signature target form includes embedded busbars attached to a power source. The thermal signature target form can provide a realistic, inexpensive and safe live-fire target for training in thermal image recognition and shooting.
Claims
exact text as granted — not AI-modified1 . A thermal target form comprising:
a formed target of a conductive polymer material; a pair of busbars connected to said formed target; a power supply; and a connector interfacing between each busbar and said power supply.
2 . A thermal target form of claim 1 wherein said formed target is three-dimensional.
3 . A thermal target form of claim 1 wherein said conductive polymer material is loaded with approximately 50% carbon fiber.
4 . A thermal target form of claim 1 wherein said formed target has slots, grooves, channels, or contours.
5 . A thermal target form of claim 1 further comprising at least two pairs of busbars connected to said formed target.
6 . A thermal target form of claim 5 wherein said pairs of busbars create a plurality of voltage regions in said formed target with differing voltage levels.
7 . A thermal target form of claim 1 wherein said conductive polymer material is divided into a plurality of regions with different carbon fiber loading levels.
8 . A thermal target form of claim 7 wherein each of said plurality of regions contains approximately 50% carbon fiber.
9 . A thermal target form of claim 7 wherein said formed target has slots, grooves, channels, or contours.
10 . A thermal target form of claim 7 further comprising at least two pairs of busbars connected to said formed target.
11 . A thermal target form of claim 10 wherein said pairs of busbars create a plurality of voltage regions in said formed target with differing voltage levels.
12 . A method of making a thermal target form comprising the steps of:
a) combining carbon fiber of an approximate loading level of approximately 50% to a base polymer resin of High Density Polyethylene to form a thermoplastic pellet; b) adjusting the carbon fiber loading level to control the volume resistivity of said thermoplastic pellet such that the target form emits an IR signature that mimics the desired simulated target when an electrical source is added; c) molding said thermoplastic pellet into a desired three-dimensional shape; d) fastening a pair of busbars to the three-dimensional shape; and e) connecting the busbars to a power source to distribute electrical current throughout the three-dimensional shape.
13 . The method of claim 12 wherein said molding of said thermoplastic pellet into said three-dimensional shape further comprises the steps of:
a) extruding the thermoplastic pellet to form a sheet; and b) thermoforming the sheet into said desired three-dimensional shape.
14 . The method of claim 12 wherein said molding of said thermoplastic pellet into said three-dimensional shape is performed by rotational molding.
15 . The method of claim 12 further comprising the step of:
forming slots, grooves, channels, or contours in the three-dimensional shape to adjust current flow to areas of the thermal target form which require higher or lower electrical power output.
16 . The method of claim 12 wherein at least two pairs of busbars are fastened to the three-dimensional shape which are capable of creating a plurality of voltage regions in said three-dimensional shape.
17 . The method of claim 12 wherein said adjusting of the carbon fiber loading level creates a plurality of regions with different carbon fiber loading levels.Join the waitlist — get patent alerts
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