US2008166473A1PendingUtilityA1
Method of producing diffractive thin-film piezoelectric micromirror
Est. expiryMay 25, 2024(expired)· nominal 20-yr term from priority
Y10S359/904G02B 26/0858B81B 3/0083G02B 26/0808B81C 1/00142
35
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Claims
Abstract
Disclosed is a method of producing a diffractive micromirror. More particularly, the present invention pertains to a method of producing a diffractive micromirror, in which a recess having a desired depth and width is precisely formed in a piezoelectric operation manner.
Claims
exact text as granted — not AI-modified1 . A method of producing a diffractive thin-film piezoelectric micromirror, comprising:
forming an insulating layer in a substrate so that the insulating layer has a predetermined thickness from a predetermined depth of the substrate; applying a mask on the substrate and subsequently forming oxidized walls; forming a piezoelectric layer on the substrate; and removing a sacrificial portion of the insulating layer to create a gap between the piezoelectric layer and the substrate to complete production of the diffractive thin-film piezoelectric micromirror.
2 . The method as set forth in claim 1 , further comprising patterning the piezoelectric layer to produce a diffractive thin-film piezoelectric micromirror array.
3 . The method as set forth in claim 2 , wherein the piezoelectric layer is patterned prior to removal of the sacrificial portion of the insulating layer.
4 . The method as set forth in claim 2 , wherein the piezoelectric layer is patterned after removal of the sacrificial portion of the insulating layer.
5 . The method as set forth in claim 1 , wherein the step of applying a mask on the substrate and subsequently forming oxidized walls comprises:
laminating the mask on the substrate; and implanting an oxidizing agent into the substrate to form the oxidized walls.
6 . The method as set forth in claim 1 , wherein the step of applying a mask on the substrate and subsequently forming oxidized walls comprises:
laminating the mask on the substrate; and providing water and oxygen to the substrate at high temperatures to form the oxidized walls.
7 . The method as set forth in claim 1 , further comprising a further step of forming a supporter for supporting the piezoelectric layer on the substrate after the step of applying a mask on the substrate and subsequently forming oxidized walls.
8 . The method as set forth in claim 1 , wherein the step of forming a piezoelectric layer on the substrate comprises:
forming a first electrode layer on the substrate; forming a piezoelectric material layer on the first electrode layer; and forming a second electrode layer having a micromirror function on the piezoelectric material layer.
9 . The method as set forth in claim 8 , further comprising: patterning the piezoelectric layer including the first electrode, the piezoelectric material, and the second electrode layers to form a diffractive thin-film piezoelectric micromirror array.
10 . The method as set forth in claim 9 , further comprising removing a portion of the piezoelectric layer which does not correspond in position to the sacrificial portion of the insulating layer after the patterning of the piezoelectric layer.
11 . The method as set forth in claim 7 , wherein the step of forming a piezoelectric layer on the substrate comprises:
forming a first electrode layer on the substrate; forming a piezoelectric material layer on the first electrode layer; removing an intermediate part of the piezoelectric layer which has a predetermined width and corresponds in position to the sacrificial portion of the insulating layer; and forming a micromirror layer on the supporter.
12 . The method as set forth in claim 11 , further comprising:
patterning the piezoelectric layer including the supporter, first electrode layer, piezoelectric material layer, and second electrode layer to form a diffractive thin-film piezoelectric micromirror array.
13 . A method of producing a diffractive thin-film piezoelectric micromirror array, comprising:
forming an insulating layer in a substrate so that the insulating layer has a predetermined thickness from a predetermined depth of the substrate; applying a mask on the substrate and subsequently forming oxidized walls; forming a piezoelectric layer on the substrate; removing a sacrificial portion of the insulating layer to create a gap between the piezoelectric layer and the substrate; and patterning the piezoelectric layer to produce a diffractive thin-film piezoelectric micromirror array.
14 . The method as set forth in claim 13 , wherein the step of applying a mask on the substrate and subsequently forming oxidized walls comprises:
laminating the mask on the substrate; and implanting an oxidizing agent into the substrate to form the oxidized walls.
15 . The method as set forth in claim 13 , wherein the step of applying a mask on the substrate and subsequently forming oxidized walls comprises:
laminating the mask on the substrate; and providing water and oxygen to the substrate at high temperatures to form the oxidized walls.
16 . The method as set forth in claim 13 , further comprising the step of forming a support layer on the substrate for supporting the piezoelectric layer after the step of applying a mask on the substrate and forming oxidized walls.
17 . The method as set forth in claim 16 , wherein the step of forming a piezoelectric layer on the substrate comprises:
forming a first electrode layer on the support layer; forming a piezoelectric material layer on the first electrode layer; and forming a second electrode layer having a micromirror function on the piezoelectric material layer.
18 . The method as set forth in claim 16 , wherein the step of forming a piezoelectric layer on the substrate comprises:
forming a first electrode layer on the support layer; forming a piezoelectric material layer on the first electrode layer; removing an intermediate portion of the piezoelectric layer corresponding to the location of the sacrificial portion of the insulating layer; and forming a micromirror layer on the support layer from where the intermediate portion of the piezoelectric layer was removed.
19 . The method as set forth in claim 13 , wherein the step of forming a piezoelectric layer on the substrate comprises:
forming a first electrode layer on the substrate; forming a piezoelectric layer on the first electrode layer; and forming a second electrode layer on the piezoelectric layer, said second electrode layer having a micromirror function.
20 . The method as set forth in claim 13 , wherein the step of forming a piezoelectric layer on the substrate comprises:
forming a first electrode layer on the substrate; forming a piezoelectric material layer on the first electrode layer; removing an intermediate portion of the piezoelectric layer disposed at a location corresponding to the location of the sacrificial portion of the insulating layer; and forming a micromirror layer on the substrate at a location where the piezoelectric layer was removed.Join the waitlist — get patent alerts
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