Component Moulding Process

Abstract

A method for embedding electronic components in a mold material for subsequent connection of the electronic components by printing on the surfaces of the set and cured mold material. The electronic components are placed on two UV transparent foils and are embedded into the mold material from two opposite sides.

1 . A method for embedding electronic components in a mold material, the method comprising:
 placing electronic components on one side of a first substantially UV transparent foil,   placing electronic components on one side of a second substantially UV transparent foil,   placing the first and the second foils substantially opposite to one another with their sides with the electronic components facing one another and with a layer of UV settable mold material placed between the two substantially UV transparent foils,   moving the first and second foils towards one another to press the electronic components into the layer of UV settable mold material and thereby embedding the electronic components into the UV settable mold material, and   setting the UV settable mold material by exposing the layer of UV settable mold material though one or both the foils to UV light.   
     
     
         2 . A method according to  claim 1 , further comprising removing the first and second foils. 
     
     
         3 . A method according to  claim 1 , further comprising curing a blank comprised of the UV settable mold material and the embedded electronic components by heating the blank. 
     
     
         4 . A method according to  claim 2 , further comprising electrically connecting the electronic components by printing connections on the surface of a blank comprised of the UV settable mold material and the embedded electronic components. 
     
     
         5 . A method according to  claim 1 , further comprising exposing both sides of a blank comprised of the UV settable mold material and the embedded electronic components to UV light. 
     
     
         6 . A method according to  claim 1 , wherein the layer of UV curable mold material is placed on one of the substantially UV transparent foils before the substantially UV transparent foils are moved towards one another. 
     
     
         7 . A method according to  claim 1 , wherein the layer of UV settable material is surrounded by a continuous or interrupted flexible or viscous dam. 
     
     
         8 . A method according to  claim 7 , wherein the flexible or viscous dam is formed by a bead or strip of a UV settable material with a viscosity greater than the viscosity of the UV settable mold material. 
     
     
         9 . A method according to  claim 1 , wherein the UV settable material and/or the UV settable mold material are epoxy or polymer based materials. 
     
     
         10 . A method according to  claim 1 , performed under vacuum or substantially reduced pressure. 
     
     
         11 . An electronic module comprising a molded material with electronic components embedded in the molded material on both sides of the electronic module, the electronic components being electrically connected by print on both sides of the electronic module.