US2008158998A1PendingUtilityA1

Flash memory device capable of preventing an overerase of flash memory cells and erase method thereof

Assignee: SAMSUNG ELECTRONICS CO LTDPriority: Jul 28, 1999Filed: Mar 14, 2008Published: Jul 3, 2008
Est. expiryJul 28, 2019(expired)· nominal 20-yr term from priority
Inventors:Ki-Hwan Choi
G11C 16/3468G11C 16/02
42
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Claims

Abstract

We describe a NAND flash memory device including a memory cell array formed on a substrate including a plurality of cell strings each including a string selecting transistor, a ground selecting transistor, and plural memory cells serially coupled between the string selecting transistor and the ground selecting transistor. A high voltage generator is configured to supply a bulk voltage to the substrate and an erase control circuit is configured to stepwise increase the bulk voltage during a first period of an erase operation and to maintain the bulk voltage substantially constant during a second period of the erase operation.

Claims

exact text as granted — not AI-modified
1 . A NAND flash memory device comprising:
 a memory cell array formed on a substrate including a plurality of cell strings each including a string selecting transistor, a ground selecting transistor, and plural memory cells serially coupled between the string selecting transistor and the ground selecting transistor;   a high voltage generator configured to supply a bulk voltage to the substrate; and   an erase control circuit configured to stepwise increase the bulk voltage during a first period of an erase operation and to maintain the bulk voltage substantially constant during a second period of the erase operation.   
   
   
       2 . The NAND flash memory device of  claim 1  comprising:
 a read circuit configured to read out data from the memory cell array responsive to the erase control circuit.   
   
   
       3 . The NAND flash memory device of  claim 2  where the erase control circuit is configured to control the high voltage generator during the first and second periods of the erase operation responsive to the read circuit reading out data from the memory cell that is pass data. 
   
   
       4 . The NAND flash memory device of  claim 2  where the erase control circuit comprises:
 a pass/fail check and control logic;   a loop counter configured to count a number of loops responsive to the pass/fail check and control logic;   a bulk step counter configured to count a number of bulk steps responsive to the pass/fail check and control logic; and   a flag counter configured to output a flag signal responsive to the pass/fail check and control logic, the flag signal indicating an end of the first period of the erase operation.   
   
   
       5 . The NAND flash memory device of  claim 4  where the flag counter is configured to output the flag signal indicating the end of the first period of the erase operation responsive to the pass/fail check and control logic and responsive to the read circuit reading out data from the memory cell that is pass data. 
   
   
       6 . The NAND flash memory device of  claim 5  where the bulk step counter is configured not to increase the bulk voltage of a next loop included in the second period of the erase operation responsive to the pass/fail check and control logic and responsive to flag indicating the end of the first period of the erase operation. 
   
   
       7 . The NAND flash memory device of  claim 5  where the bulk step counter is configured to increase the bulk voltage of a next loop included in the second period by an increment while maintaining substantially constant the bulk voltage of other loops included in the second period responsive to the flag indicating the end of the first period of the erase operation. 
   
   
       8 . The NAND flash memory device of  claim 2  where during erase verify operations of respective loops included in the first period of the erase operation, the read circuit is configured to substantially simultaneously apply a first erase verify voltage to wordlines of the memory cell array responsive to the erase control circuit. 
   
   
       9 . The NAND flash memory device of  claim 8  where during erase verify operations of respective loops included in the second period of the erase operation, the read circuit is configured to substantially simultaneously apply a second erase verify voltage lower than the first erase verify voltage to the wordlines of the memory cell array responsive to the erase control circuit. 
   
   
       10 . The NAND flash memory device of  claim 2  where during erase verify operations of respective loops included in the first period of the erase operation, the read circuit is configured to apply a first erase verify voltage to a selected wordline of the memory cell array and to apply a read voltage to unselected wordlines of the memory cell array responsive to the erase control circuit. 
   
   
       11 . The NAND flash memory device of  claim 10  where during erase verify operations of respective loops included in the second period of the erase operation, the read circuit is configured to apply a second erase verify voltage lower than the first erase verify voltage to a selected wordline of the memory cell array and to apply a read voltage to unselected wordlines of the memory cell array. 
   
   
       12 . A method, comprising:
 supplying a bulk voltage to a substrate having formed thereon a memory cell array including a plurality of cell strings each having a string selecting transistor, a ground selecting transistor, and plural memory cells serially coupled between the string selecting transistor and the ground selecting transistor;   stepwise increasing the bulk voltage during a first period of an erase operation; and   maintaining the bulk voltage substantially constant during a second period of the erase operation.   
   
   
       13 . The method of  claim 12  comprising
 reading out data from the memory cell array responsive to the erase control circuit.   
   
   
       14 . The method of  claim 13  comprising:
 controlling a high voltage generator during the first and second periods of the erase operation responsive to determining the data read out from the memory cell array as pass data.   
   
   
       15 . The method of  claim 13  comprising:
 counting a number of loops responsive to a pass/fail check and control logic;   counting a number of bulk steps responsive to the pass/fail check and control logic; and   setting a flag signal responsive to the pass/fail check and control logic to indicate an end of the first period of the erase operation.   
   
   
       16 . The method of  claim 15  comprising:
 setting the flag indicating the end of the first period of the erase operation responsive to the pass/fail check and control logic and responsive to reading out data from the memory cell that is pass data.   
   
   
       17 . The method of  claim 16  comprising:
 not increasing the bulk voltage of a next loop included in the second period of the erase operation responsive to the pass/fail check and control logic and responsive to setting the flag indicating the end of the first period of the erase operation.   
   
   
       18 . The method of  claim 16  comprising:
 increasing the bulk voltage of a next loop included in the second period by an increment while maintaining substantially constant the bulk voltage of other loops included in the second period responsive to setting the flag indicating the end of the first period of the erase operation.   
   
   
       19 . The method of  claim 13  comprising:
 substantially simultaneously applying a first erase verify voltage to wordlines of the memory cell array during erase verify operations of respective loops included in the first period of the erase operation.   
   
   
       20 . The method of  claim 19  comprising:
 substantially simultaneously applying a second erase verify voltage lower than the first erase verify voltage to the wordlines of the memory cell array during erase verify operations of respective loops included in the second period of the erase operation.

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