Chip mount, methods of making same and methods for mounting chips thereon

Abstract

The present invention describes a pre-fabricated chip mount and a method for making the pre-fabricated mount. The mount includes a mount body and a protective ring attached to the body by a plurality of tabs. The mount also includes a plurality of inner leads in electrical communication with the wires of at least one leadframe and a receiving area for an integrated circuit chip. The present invention also describes chips mounted on the pre-fabricated mount and methods for mounting, wire-bonding and encapsulating the chip in the mount. The mounts of the present invention can also be adapted to accommodate multiple chips and multi-level bonding schemes to the chips.

1 . A pre-fabricated chip mount comprising:
 a. a mount body;   b. a plurality of flag areas disposed in a top or bottom surface of the mount body;   c. a plurality of lead structures comprising bottom leads, top leads, and insulating layers interposed between corresponding top leads and bottoms leads, one structure for each flag area, where each top lead include an inner part, an outer part and a bump adapted to allow encapsulating material to encapsulate the inner part leaving the outer part exposed and where each bottom lead includes an inner part adapted to be encapsulated by the encapsulating material and an outer exposed part, and   where each flag area is designed to receive a chip and wire bonds bonding chip contacts to corresponding inner parts of the top leads and bottom leads of the lead structure associated with the flag area and where the pre-fabricated chip mount is designed to have each flag area, the chips, the wire bonds, the inner parts of the top and bottom leads and a portion of the mount body between the bumps on the top leads embedded in a nonconductive material.   
     
     
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         25 . The mount of  claim 1 , wherein the leads comprise a plurality of leadframes. 
     
     
         26 . The mount of  claim 1 , wherein the flag areas are located in a top surface of the mount body. 
     
     
         27 . The mount of  claim 26 , wherein each flag area includes a metallic base onto which each chip is mounted and wherein each flag area is located in an indentation in the mount body. 
     
     
         28 . A mounted chip comprising:
 a. a pre-fabricated chip mount including:
 i. mount body; 
 ii. a plurality of flag areas disposed in a top or bottom surface of the mount body; 
 iii. a plurality of lead structures comprising bottom leads, top leads, and insulating layers interposed between corresponding top leads and bottoms leads, one structure for each flag area, where each top lead include an inner part, an outer part and a bump adapted to allow encapsulating material to encapsulate the inner part leaving the outer part exposed and where each bottom lead includes an inner part adapted to be encapsulated by the encapsulating material and an outer exposed part, 
   b. a chip mounted in each flag area;   c. a plurality of electrically conductive wire bonds connecting contacts on the chip to corresponding inner parts of the top leads and bottom leads of the lead structure associated with the flag area; and   d. a cover comprising a nonconductive material embedding the flag areas, the chips, the wire bonds, the inner parts of the top and bottom leads and a portion of the mount body between the bumps on the top leads in the nonconductive material.   
     
     
         29 . The chip of  claim 28 , wherein the leads comprise a plurality of leadframes. 
     
     
         30 . The chip of  claim 28 , wherein the flag areas are located in a top surface of the mount body. 
     
     
         31 . The chip of  claim 30 , wherein each flag area includes a metallic base onto which each chip is mounted and wherein each flag area is located in an indentation in the mount body. 
     
     
         32 . The chip of  claim 28 , wherein the leads comprise a plurality of leadframes. 
     
     
         33 . The chip of  claim 28 , wherein each flag area includes a metallic base onto which each chip is mounted and wherein each flag area is located in an indentation in the mount body.