Printed Board Assembly with Improved Heat Dissipation

Abstract

A multi-layer printed board assembly (PBA) with improved heat dissipation characteristics. The PBA includes a cooling component, which extends essentially perpendicularly through the layers of the PBA. A first end of the cooling component contacts a cooling structure external to the PBA. An electronic component is surface mounted at least partially over a second end of the cooling component. The cooling component transports heat from the electronic component through the PBA to the external cooling structure.

1 - 8 . (canceled) 
   
   
       9 . A printed board assembly (PBA) comprising:
 a first support layer having a first main surface;   a first layer of a conducting material arranged in a first pattern on the first main surface;   a first electronics component mounted on the first main surface; and   a first cooling component for transporting heat from the first electronics component to a cooling structure external to the PBA;   wherein:
 the first electronics component is surface mounted on the PBA at least partially over the first cooling component; 
 the first cooling component is arranged integrally, by means of soldering, in the PBA to conduct heat in a direction which is essentially perpendicular to the first main surface of the first support layer; 
 the first cooling component is arranged so that an upper surface of the first cooling component is flush with the first main surface of the first support layer; and 
 the first layer of the conducting material is made to cover the upper surface of the first cooling component. 
   
   
   
       10 . The PBA as recited in  claim 9 , wherein the first support layer is a two-part structure comprising:
 a first part having a through-hole with a first cross sectional area; and   a second part having a through-hole with a second cross sectional area;   wherein the first cooling component includes two parts which have different cross sectional areas that match the different cross sectional areas of the two parts of the first support layer, so that a ledge in the PBA receives the first part of the cooling component.   
   
   
       11 . The PBA as, recited in  claim 10 , wherein the upper surface of the second part of the first support layer has a circuit pattern arranged on it. 
   
   
       12 . The PBA as recited in  claim 9 , wherein the first electronics component is surface mounted on the PBA by means of soldering, gluing, or applying pressure from an external component. 
   
   
       13 . The PBA as recited in  claim 9 , wherein the first cooling component emerges on a lower main surface of the PBA. 
   
   
       14 . A method of manufacturing a printed board assembly (PBA), comprising the steps of:
 preparing an opening in a layer of a non-conducting laminate for receiving a first cooling component;   preparing the cooling component for being fitted into the opening in the laminate;   fitting the cooling component into the laminate;   preparing circuit patterns on at least a first main side of the laminate;   processing the laminate and the cooling component so that they together become a PBA;   fitting the cooling component into the laminate in a direction which is essentially perpendicular to a main surface of the laminate;   surface mounting a first electronics component on the PBA at least partially over the first cooling component;   wherein the method includes:
 arranging the first cooling component so that a first surface of the first cooling component is flush with the first main surface of the laminate; and 
 arranging a first layer of a conducting material to cover the first surface of the first cooling component. 
   
   
   
       15 . The method as recited in  claim 14 , wherein:
 the laminate is prepared as a two-part structure, a first part having a through-hole with a first cross sectional area and a second part having a through-hole with a second cross sectional area; and   the first cooling component is includes two parts which have different cross sectional areas, said areas being made to match the different cross sectional areas of the two parts of the first support layer, so that a ledge in the PBA receives the first part of the cooling component.   
   
   
       16 . The method as recited in  claim 15 , wherein a circuit pattern is arranged on the upper surface of the second part of the laminate. 
   
   
       17 . The method as recited in  claim 14 , wherein the first electronics component is surface mounted to the board by means of soldering, gluing, or applying pressure from an external component. 
   
   
       18 . The method as recited in  claim 14 , further comprising:
 arranging the first cooling component so that a second surface of the first cooling component contacts a cooling structure external to the PBA, wherein the first cooling component transports heat from the first electronics component to the cooling structure.