Printed wiring board, printed circuit board, and electronic device

Abstract

According to one embodiment, a printed wiring board includes a plurality of pads to which bumps are to be bonded respectively. The pads are each formed with a plurality of conductors, the conductors are separate from each other and correspond to one of the bumps, and the plurality of conductors define a gap therebetween, the gap being capable of receiving part of the one of the bumps.

1 . A printed wiring board comprising:
 a plurality of pads to which bumps are to be bonded respectively,   wherein the pads are each formed with a plurality of conductors, the conductors are separate from each other and correspond to one of said bumps, and   the plurality of conductors define a gap therebetween, the gap being capable of receiving part of the one of said bumps.   
   
   
       2 . The printed wiring board according to  claim 1 , further comprising wirings which are provided on the printed wiring board,
 wherein at least one of said conductors is electrically connected to none of the wirings.   
   
   
       3 . The printed wiring board according to  claim 1 , further comprising a wiring which is provided on the printed wiring board and forms part of a circuit,
 wherein at least one of said conductors is electrically connected to the wiring.   
   
   
       4 . The printed wiring board according to  claim 1 , further comprising a protective film including an opening formed therein through which the pads are exposed to outside,
 wherein at least some of said plurality of conductors are electrically connected to each other in regions covered with the protective film.   
   
   
       5 . The printed wiring board according to  claim 1 , further comprising a protective film including an opening formed therein through which the pads are exposed to outside,
 wherein said plurality of conductors extend in the direction of crossing the opening and in parallel with each other.   
   
   
       6 . The printed wiring board according to  claim 5 , wherein the plurality of pads are arranged side by side,
 the opening of the protective film extends in the direction in which the plurality of pads are arranged and exposes the pads to outside altogether, and   said plurality of conductors are arranged side by side in the direction in which the plurality of pads are arranged.   
   
   
       7 . The printed wiring board according to  claim 5 , wherein at least one of said plurality of conductors is divided in the extending direction inside the opening. 
   
   
       8 . The printed wiring board according to  claim 1 , further comprising a protective film including an opening formed therein through which the pads are exposed to outside,
 wherein the at least one of said conductors includes a linear part extending in the direction of crossing the opening and an expansion part extending in the width direction of the linear part inside the opening.   
   
   
       9 . A printed circuit board comprising:
 a circuit component;   bumps electrically connected to the circuit component; and   a printed wiring board on which the circuit component is mounted, the printed wiring board including a plurality of pads to which the bumps are bonded respectively,   wherein the pads are each formed with a plurality of conductors, the conductors are separate from each other and correspond to one of said bumps, and   the plurality of conductors define a gap therebetween, the gap receiving part of the one of said bumps.   
   
   
       10 . An electronic device comprising, a printed circuit board,
 wherein the printed circuit board includes:   a circuit component;   bumps electrically connected to the circuit component; and   a printed wiring board on which the circuit component is mounted, the printed wiring board including a plurality of pads to which the bumps are bonded respectively,   the pads are each formed with a plurality of conductors, the conductors are separate from each other and correspond to one of said bumps, and   the plurality of conductors define a gap therebetween, the gap receiving part of the one of said bumps.