Heat exchanger, arrangement and process for the production of a heat exchanger
Abstract
Specified is a heat exchanger, in particular an exhaust-gas heat exchanger or charge-air heat exchanger, for exchanging heat between a first fluid, in particular an exhaust gas or charge air, and a second fluid, in particular a coolant, which heat exchanger has: a block for separate and heat-exchanging guidance of the first and second fluids; a block closure element for connecting the block to a fluid connection. In order to eliminate the problems which occur in particular during a soldering process and to reduce thermal stresses in operation, the block closure element has a contact face arranged at the block side, with a surface normal of the contact face being aligned substantially in a radial direction in order to form a radial stop for a block edge, and a cohesive connection, in particular as a soldered connection, is formed in a joining region between the contact face and the block edge. The invention specifies an arrangement and a method for producing the heat exchanger.
Claims
exact text as granted — not AI-modified1 . Heat exchanger for exchanging heat between a first fluid and a second fluid, having:
a block for separate and heat-exchanging guidance of the first and second fluids; at least one block closure element for connecting the block to at least one fluid connection;
characterized in that
the block closure element has a contact face arranged at the block side, with a surface normal of the contact face being aligned substantially in a radial direction in order to form a radial stop for a block edge, and
a cohesive connection is formed in the joining region between the contact face and the block edge.
2 . Heat exchanger according to claim 1 , characterized in that the cohesive connection is formed as a soldered connection and/or welded connection and/or adhesive connection.
3 . Heat exchanger according to claim 1 , characterized in that the contact face is formed as a contact face which runs at least around a part of the periphery of the block closure element, in particular the contact face runs continuously along an entire periphery of the block closure element.
4 . Heat exchanger according to claim 1 , characterized in that a profile and/or a contour of the contact face corresponds, in order to form a form-fitting connection between the contact face and a block edge, to a profile and/or a contour of the block edge.
5 . Heat exchanger according to claim 1 , characterized in that the contact face is part of a stepped contour which runs partially or entirely along the periphery.
6 . Heat exchanger according to claim 1 , characterized in that the contact face is part of a groove contour which runs partially or entirely along the periphery.
7 . Heat exchanger according to claim 1 , characterized in that the block closure element has a groove in which a block edge is held in particular with an end-side contour of the block edge.
8 . Heat exchanger according to claim 1 , characterized in that the soldered connection encompasses a joining region between the contact face and block edge of less than 0.2 mm, preferably of less than 0.1 mm.
9 . Heat exchanger according to claim 1 , characterized in that the contact face and/or the block edge, between which a cohesive connection, in particular as a soldered connection, is formed, is arranged predominantly perpendicular or at an obtuse angle with respect to a main soldering direction.
10 . Heat exchanger according to claim 1 , characterized in that the contact face and the block edge are fixed to one another, preferably cohesively fixed to one another, in particular fixed to one another by welding, at least one point before a cohesive connection, in particular before a soldered connection.
11 . Heat exchanger according to claim 10 , characterized in that the contact face and the block edge, between which a cohesive connection, in particular as a soldered connection, is formed, is formed predominantly in one direction along the fixed point.
12 . Heat exchanger according to claim 1 , characterized in that the contact face is formed on an extension which projects from the block closure element at the block side.
13 . Heat exchanger according to claim 1 , characterized in that the block edge is formed on a housing of the block in particular a multi-part housing, with the housing having a casing and a lid, with the casing and the lid in particular being of U-shaped design.
14 . Heat exchanger according to claim 1 , characterized in that the block edge has a spacer extension between a casing and a lid of a housing.
15 . Heat exchanger according to claim 1 , characterized in that the block closure element is provided at least for connecting the block to a fluid connection in the form of an inlet opening and/or outlet opening for the first fluid.
16 . Heat exchanger according to claim 1 , characterized in that the block closure element is formed in the manner of a diffuser, in particular an inlet diffuser or outlet diffuser.
17 . Heat exchanger according to claim 1 , characterized in that the block closure element is formed in the manner of a flange, in particular an inlet flange or outlet flange.
18 . Heat exchanger according to claim 1 in the form of an exhaust-gas heat exchanger, in particular cooler.
19 . Heat exchanger according to claim 1 in the form of a charge-air heat exchanger, in particular cooler.
20 . Arrangement for producing a heat exchanger according to claim 1 , having
a block for separate and heat-exchanging guidance of the first and second fluids; at least one block closure element for connecting the block to at least one fluid connection;
characterized in that
the block closure element has a contact face arranged at the block side, with a surface normal of the contact face being aligned substantially in a radial direction in order to form a radial stop for a block edge, and
with a gap provided for the formation of a cohesive connection as a soldered connection being formed between the contact face and the block edge.
21 . Arrangement according to claim 20 , characterized in that the cohesive connection is formed as a soldered connection and/or welded connection and/or adhesive connection.
22 . Arrangement according to claim 20 , characterized in that the gap for the formation of a cohesive connection, in particular as a soldered connection, is limited in width, in particular the gap encompasses a width between the contact face and block edge of less than 0.2 mm, preferably of less than 0.1 mm.
23 . Arrangement according to claim 20 , characterized in that the gap is filled with solder and/or the solder is arranged in the direct vicinity of the gap in a region suitable for forming a solder reservoir.
24 . Arrangement according to claim 20 , characterized in that the solder reservoir is formed in a spacing region formed between the block and the block closure element.
25 . Arrangement according to claim 20 , characterized in that a region or spacing region is formed in the manner of a bevel, in particular between a first face at an angle with respect to the contact face and a second face perpendicular to the block edge, in particular perpendicular to a block edge face.
26 . Arrangement according to claim 20 , characterized in that a region or spacing region is formed in the manner of a play spacing between the block closure element and the block, in particular between a first face perpendicular to the contact face and a second face perpendicular to the block edge, in particular perpendicular to a block edge face.
27 . Arrangement according to claim 20 , characterized in that the contact face and the block edge are fixed to one another at least one point before a soldered connection, in particular the contact face and the block edge, between which a cohesive connection as a soldered connection is to be formed, is formed predominantly along the at least one fixed point.
28 . Arrangement according to claim 20 , characterized in that the housing is formed in the manner of a multi-part housing with an in particular U-shaped casing and lid, with the contact face and the block edge being fixed to one another only in the region of the casing before a cohesive connection, in particular before a soldered connection.
29 . Arrangement according to claim 20 , characterized in that the gap encompasses a width between the contact face and block edge in the region of the lid of less than 0.1 mm.
30 . Arrangement according to claim 20 , characterized in that the block and the block closure element are arranged in a soldering stand, in particular the soldering stand has a lower coefficient of thermal expansion than the block and/or the block closure element.
31 . Arrangement according to claim 30 , characterized in that the soldering stand is formed at least partially from a carbon-fibre-reinforced material and/or a ceramic material.
32 . Method for producing a heat exchanger according to claim 19 , having the steps:
providing the block for separate and heat-exchanging guidance of the first and second fluids; providing the at least one block closure element for connecting the block to at least one fluid connection;
characterized in that
the block closure element has a contact face arranged at the block side, with a surface normal of the contact face being aligned substantially in a radial direction in order to form a radial stop for a block edge, and with a gap provided for the formation of a cohesive connection being formed between the contact face and the block edge, with the block closure element being plugged onto the block, and the cohesive connection being formed.
33 . Method according to claim 32 , characterized in that the cohesive connection is formed as a soldered connection, with the gap being filled with solder and/or the solder being arranged in the direct vicinity of the gap in a region suitable for forming a solder reservoir and a soldering process being carried out, with the block edge bearing against the contact face while the solder melts.
34 . Method according to claim 32 , characterized in that the block closure element is plugged into the block, so that the contact face is arranged facing the block edge.
35 . Method according to claim 32 , characterized in that a housing is formed in the manner of a multi-part housing with an in particular U-shaped casing and lid, and the contact face and the block edge are fixed to one another only in the region of the casing before a cohesive connection, in particular before a soldered connection.
36 . Method according to claim 32 , characterized in that the block with the block closure element is placed into a soldering stand, in particular the soldering stand has a lower coefficient of thermal expansion than the block and/or the block closure element ( 1 , 1 A, 1 B, 1 C, 1 D, 1 E).
37 . Method according to claim 36 , characterized in that the coefficient of thermal expansion of the soldering stand is lower than that of the block and/or of the block closure element in such a way that the contact face and the block edge are pressed against one another before the melting of the solder.
38 . Method according to claim 32 , characterized in that the block closure element, in particular a diffuser or flange, is provided by means of a deep-drawing process or punching process or casting process.
39 . Method according to claim 32 , characterized in that the housing or the housing parts, in particular the casing and/or the lid, are provided as a deep-drawn part.
40 . Method according to claim 32 , characterized in that the contact face is formed in a milling process and/or erosion process.Join the waitlist — get patent alerts
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