Preparing composites by using resins

Abstract

A method for making a part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices, (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer, whereby the cured or uncured upper layer becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) optionally curing the lower layer resulting from step (d) if the lower layer is uncured to yield a cured lower layer; (f) after step (e), optionally providing a new uncured upper layer on the uncured upper layer provided in step (d), whereby the uncured upper layer provided in step (d) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (g) after step (f) curing the uncured upper layer and/or the uncured lower layer(s) after step (f) using an electron beam; and (h) optionally-repeating steps (d) through (g) a number of times to form a desired number of cured layers.

1 - 49 . (canceled) 
   
   
       50 . A method for making a part, the method comprising:
 (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam;   (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer from step (c), whereby the cured or uncured upper layer from step (c) becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (e) optionally curing the lower layer resulting from step (d) if the lower layer is uncured to yield a cured lower layer;   (f) after step (e) curing the uncured upper layer using an electron beam; and   (g) optionally repeating steps (d) through (f) a number of times to form a desired number of cured layers; wherein the uncured upper layer in step (c) has a first length in an x direction, a first width in a y direction, and a first depth in a z direction, and wherein the uncured upper layer in step (c) optionally further comprises fibers in the resin generally in the z direction; wherein the uncured upper layer in step (g) has a second length in the x direction, a second width in the y direction, and a second depth in the z direction, and wherein the uncured upper layer in step (f) optionally further comprises fibers in the resin generally in the z direction; wherein the uncured lower layer in step (c) has a third length in the x direction, a third width in the y direction, and a third depth in the z direction, and wherein the uncured lower layer in step (c) optionally further comprises fibers in the resin generally in the z direction; wherein step (f) yields a cured upper layer that is bonded to the cured lower layer and that is also connected to the cured lower layer by the fibers in the z direction; wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the x direction is generally perpendicular to the y direction.   
   
   
       51 . A method for making a part, the method comprising:
 (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (b) curing the uncured upper layer using an electron beam;   (c) after step (b), providing a new uncured upper layer on the cured upper layer from step (b), whereby the cured upper layer from step (b) becomes a cured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (d) after step (c) curing the uncured upper layer using an electron beam; and   (e) optionally repeating steps (c) through (d) a number of times to form a desired number of cured layers; wherein the uncured upper layer in step (b) has a first length in an x direction, a first width in a y direction, and a first depth in a z direction, and wherein the uncured upper layer in step (b) optionally further comprises fibers in the resin generally in the z direction; and wherein the uncured upper layer in step (d) has a second length in the x direction, a second width in the y direction, and a second depth in the z direction, and wherein the uncured upper layer in step (d) optionally further comprises fibers in the resin generally in the z direction; wherein step (d) yields a cured upper layer that is bonded to the cured lower layer and that is also connected to the cured lower layer by the fibers in the z direction; wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the x direction is generally perpendicular to the y direction.   
   
   
       52 . A method for making a part, the method comprising:
 (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam;   (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer from step (c), whereby the cured or uncured upper layer from step (c) becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (e) optionally curing the lower layer resulting from step (d) if the lower layer is uncured to yield a cured lower layer;   (f) after step (e), optionally providing a new uncured upper layer on the uncured upper layer provided in step (d), whereby the uncured upper layer provided in step (d) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (g) after step (f) curing the uncured upper layer and/or the uncured lower layer(s) after step (f) using an electron beam; and   (h) optionally repeating steps (d) through (g) a number of times to form a desired number of cured layers; wherein the uncured upper layer in step (c) has a first length in an x direction, a first width in a y direction, and a first depth in a z direction, and wherein the uncured upper layer in step (c) optionally further comprises fibers in the resin generally in the z direction; and wherein the uncured upper layer in step (g) has a second length in the x direction, a second width in the y direction, and a second depth in the z direction, and wherein the uncured upper layer in step (g) optionally further comprises fibers in the resin generally in the z direction; wherein the uncured lower layer in step (c) has a third length in the x direction, a third width in the y direction, and a third depth in the z direction, and wherein the uncured lower layer in step (c) optionally further comprises fibers in the resin generally in the z direction; and wherein the uncured lower layer in step (g) has a fourth length in the x direction, a fourth width in the y direction, and a fourth depth in the z direction, and wherein the uncured lower layer in step (g) optionally further comprises fibers in the resin generally in the z-direction; wherein step (f) is not optional; wherein step (g) comprises curing the uncured lower layer resulting from step (f) to yield a cured lower layer that is bonded to a previously cured lower layer and that is also connected to the previously cured lower layer by the fibers in the z direction; wherein the z direction is generally perpendicular to both the x direction and the y direction; and wherein the x direction is generally perpendicular to the y direction.   
   
   
       53 . A method as claimed in  claim 50 , wherein the x direction and the y direction form an angle of about 70 degrees to about 110 degrees, wherein the x direction and the z direction form an angle of about 70 degrees to about 110 degrees, and wherein the y direction and the z direction form an angle of about 70 degrees to about 110 degrees. 
   
   
       54 . A method as claimed in  claim 50 , wherein the x direction and the y direction form an angle of about 85 degrees to about 95 degrees, wherein the x direction and the z direction form an angle of about 85 degrees to about 95 degrees, and wherein the y direction and the z direction form an angle of about 85 degrees to about 95 degrees. 
   
   
       55 . A method as claimed in  claim 51 , wherein the x direction and the y direction form an angle of about 70 degrees to about 110 degrees, wherein the x direction and the z direction form an angle of about 70 degrees to about 110 degrees, and wherein the y direction and the z direction form an angle of about 70 degrees to about 110 degrees. 
   
   
       56 . A method as claimed in  claim 51 , wherein the x direction and the y direction form an angle of about 85 degrees to about 95 degrees, wherein the x direction and the z direction form an angle of about 85 degrees to about 95 degrees, and wherein the y direction and the z direction form an angle of about 85 degrees to about 95 degrees. 
   
   
       57 . A method as claimed in  claim 52 , wherein the x direction and the y direction form an angle of about 70 degrees to about 110 degrees, wherein the x direction and the z direction form an angle of about 70 degrees to about 110 degrees, and wherein the y direction and the z direction form an angle of about 70 degrees to about 110 degrees. 
   
   
       58 . A method as claimed in  claim 52 , wherein the x direction and the y direction form an angle of about 85 degrees to about 95 degrees, wherein the x direction and the z direction form an angle of about 85 degrees to about 95 degrees and wherein the y direction and the z direction form an angle of about 85 degrees to about 95 degrees. 
   
   
       59 . A method for making a part, the method comprising:
 (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam;   (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer, whereby the cured or uncured upper layer becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (e) optionally curing the lower layer resulting from step (d) if the lower layer is uncured to yield a cured lower layer;   (f) after step (e), optionally providing a new uncured upper layer on the uncured upper layer provided in step (d), whereby the uncured upper layer provided in step (d) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices;   (g) after step (f) curing the uncured upper layer and/or the uncured lower layer(s) after step (f) using an electron beam; and   (h) optionally repeating steps (d) through (g) a number of times to form a desired number of cured layers; wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) comprises electronic devices.   
   
   
       60 . A method as claimed in claim  1 , wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) comprises electronic devices. 
   
   
       61 . A method as claimed in  claim 50 , wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) comprises electronic devices. 
   
   
       62 . A method as claimed in  claim 51 , wherein at least the uncured upper layer in step (a) or the new uncured upper layer in step (c) comprises electronic devices. 
   
   
       63 . A method as claimed in  claim 52 , wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) comprises electronic devices. 
   
   
       64 - 67 . (canceled) 
   
   
       68 . A method as claimed in  claim 50 , wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) is nonmetallic. 
   
   
       69 . A method as claimed in  claim 51 , wherein at least the uncured upper layer in step (a) or the new uncured upper layer in step (c) is nonmetallic. 
   
   
       70 . A method as claimed in  claim 52 , wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) is nonmetallic. 
   
   
       71 . A method as claimed in  claim 59 , wherein at least the uncured upper layer in step (a), the new uncured upper layer in step (b), the new uncured upper layer in step (d), or the new uncured upper layer in step (f) is nonmetallic.