Cmp pad conditioners and associated methods

Abstract

A method of reducing a degree of compression of a CMP pad during conditioning of the CMP pad comprises engaging the CMP pad with at least one superhard cutting element, the cutting element including a cutting face, the cutting face being angled at 90 degrees or less relative to a finished surface of the CMP pad; and moving the CMP pad and the cutting element relative to one another in a direction resulting in removal of material from the CMP pad with the cutting face to thereby condition the CMP pad.

1 . A method of reducing a degree of compression of a CMP pad during conditioning of the CMP pad, comprising:
 engaging the CMP pad with at least one superhard cutting element, the cutting element including a cutting face, the cutting face being angled at 90 degrees or less relative to a finished surface of the CMP pad; and   moving the CMP pad and the cutting element relative to one another in a direction resulting in removal of material from the CMP pad with the cutting face to thereby condition the CMP pad.   
   
   
       2 . The method of  claim 1 , wherein the cutting face is oriented at about 90 degrees relative to the finished surface of the CMP pad. 
   
   
       3 . The method of  claim 1 , wherein the cutting face is oriented at an angle less than 90 degrees relative to the finished surface of the CMP pad. 
   
   
       4 . The method of  claim 1 , wherein the cutting face is oriented at an angle greater than 45 degrees and less than 90 degrees. 
   
   
       5 . The method of  claim 1 , wherein the cutting element includes a distal portion and a proximal portion, the proximal portion being closer to a base from which the cutting element extends than is the distal portion, and wherein the distal portion includes a wider cross section than does the proximal portion. 
   
   
       6 . The method of  claim 1 , wherein the cutting element includes a cross section and extends from a base, and wherein the cross section of the cutting element includes a narrowed portion intermediate ends of the cutting element. 
   
   
       7 . The method of  claim 1 , wherein engaging the CMP pad comprises engaging the CMP pad with a plurality of superhard cutting elements. 
   
   
       8 . The method of  claim 7 , wherein the superhard cutting elements are formed from a polycrystalline diamond compact. 
   
   
       9 . The method of  claim 7 , wherein the plurality of cutting elements are formed from a polycrystalline cubic boron nitride compact. 
   
   
       10 . The method of  claim 1 , wherein the cutting element includes a trailing edge angled to provide a relief area between the finished surface of the CMP pad and the cutting element. 
   
   
       11 . The method of  claim 1 , wherein the cutting element includes a trailing edge that is substantially parallel to the finished surface of the CMP pad. 
   
   
       12 . The method  claim 1 , wherein the cutting element comprises a cutting blade having a cutting length at least twice as great as a cutting height. 
   
   
       13 . A pad conditioner for removing material from a CMP pad while minimizing compression of the CMP pad, comprising:
 a base; and   a plurality of superhard cutting elements, extending from the base, the cutting elements each having a cutting face angled at 90 degrees or less relative to a finished surface of the CMP pad;   the faces of the cutting elements being oriented such that relative movement of the pad conditioner and the CMP pad results in removal of material from the CMP pad with the cutting faces to thereby condition the CMP pad.   
   
   
       14 . The pad conditioner of  claim 13 , wherein each of the cutting faces is oriented at about 90 degrees relative to the finished surface of the CMP pad. 
   
   
       15 . The pad conditioner of  claim 13 , wherein each of the cutting faces is oriented at an angle less than 90 degrees relative to the finished surface of the CMP pad. 
   
   
       16 . The pad conditioner of  claim 13 , wherein each of the cutting faces is oriented at an angle greater than 45 degrees and less than 90 degrees relative to the finished surface of the CMP pad. 
   
   
       17 . The pad conditioner of  claim 13 , wherein each of the cutting elements includes a distal portion and a proximal portion, the proximal portion being closer to a base from which the cutting elements extend than is the distal portion, and wherein a cross section of the distal portion is wider than a cross section of the proximal portion. 
   
   
       18 . The pad conditioner of  claim 13 , wherein each of the cutting elements includes a cross section and extends from a base, and wherein the cross section of the cutting element includes a narrowed portion intermediate ends of the cutting element. 
   
   
       19 . The pad conditioner of  claim 13 , wherein the superhard cutting elements are formed from an integral piece of a polycrystalline diamond compact. 
   
   
       20 . The pad conditioner of  claim 13 , wherein the plurality of cutting elements are formed from a polycrystalline cubic boron nitride compact. 
   
   
       21 . The pad conditioner of  claim 13 , wherein each of the cutting elements includes a trailing edge angled to provide a relief area between the finished surface of the CMP pad and the cutting element. 
   
   
       22 . The pad conditioner of  claim 13 , wherein the cutting element includes a trailing edge that is substantially parallel to the finished surface of the CMP pad. 
   
   
       23 . The pad conditioner of  claim 13 , wherein the cutting element comprises a cutting blade having a cutting length at least twice as great as a cutting height. 
   
   
       24 . A method of reducing a degree of compression of a CMP pad during conditioning of the CMP pad, comprising:
 engaging the CMP pad with a plurality of superhard cutting elements formed from a polycrystalline diamond compact, each of the cutting elements including a cutting face, the cutting faces being angled at 90 degrees or less relative to a finished surface of the CMP pad; and   moving the CMP pad and the cutting element relative to one another in a direction resulting in removal of material from the CMP pad with the cutting face to thereby condition the CMP pad.   
   
   
       25 . The method of  claim 24 , wherein the cutting elements extend from a base, and wherein the base and the cutting elements are formed from an integral piece of a polycrystalline diamond compact.