Electronic Apparatus with an Antenna

Abstract

An electronic apparatus with an antenna, an anti-jamming system and a method are disclosed. The electronic apparatus comprises a casing and the antenna. The antenna is composed of a patterned metal thin film and a carrier and provided for processing a wireless signal. The casing and the antenna are made by injection molding. When the electronic apparatus has a display device, the anti-jamming system can modulate a clock signal generated by the display device to prevent the multiplication of clock signal from interfering with signals within an operating band of the antenna.

1 . An electronic apparatus with an antenna, comprising:
 a casing; and   an antenna, composed of a patterned metal thin film and a carrier, for processing a wireless signal;   wherein said casing and said antenna are made by injection molding.   
   
   
       2 . The electronic apparatus of  claim 1 , wherein said carrier is selected from a group consisting of a flexible printed circuit (FPC) or a metal plated plastic film. 
   
   
       3 . The electronic apparatus of  claim 1 , wherein said antenna is selected from a group consisting of a meander-line antenna, a dipole antenna, a fractal antenna or an inverted F antenna (IFA). 
   
   
       4 . The electronic apparatus of  claim 1 , wherein said electronic apparatus is selected from a group consisting of a notebook computer, a personal digital assistant, an electronic dictionary or a wireless communication apparatus. 
   
   
       5 . The electronic apparatus of  claim 1 , wherein said patterned metal thin film is a metal conductor made of a material selected from the collection of copper, gold and silver. 
   
   
       6 . An antenna for processing a wireless signal, comprising a patterned metal thin film and a carrier, wherein said antenna and a casing of an electronic apparatus are made of an injection molding. 
   
   
       7 . The antenna of  claim 6 , wherein said carrier is selected from a group consisting of a flexible printed circuit (FPC) or a metal plated plastic film. 
   
   
       8 . The antenna of  claim 6 , wherein said antenna is selected from a group consisting of a meander-line antenna, a dipole antenna, a fractal antenna or an inverted F antenna (IFA). 
   
   
       9 . The antenna of  claim 6 , wherein said electronic apparatus is selected from a group consisting of a notebook computer, a personal digital assistant, an electronic dictionary or a wireless communication apparatus. 
   
   
       10 . The antenna of  claim 6 , wherein said patterned metal thin film is a metal conductor made of a material selected from the collection of copper, gold and silver. 
   
   
       11 . A method for manufacturing a casing structure with an antenna, and said casing structure being applicable for an electronic apparatus, and said method comprising the steps of:
 setting a patterned metal thin film on a carrier to form an antenna for processing a wireless signal; and   placing said antenna in a mold for performing an injection process to form said casing structure.   
   
   
       12 . The method of  claim 11 , wherein said carrier is selected from a group consisting of a flexible printed circuit (FPC) or a metal plated plastic film. 
   
   
       13 . The method of  claim 11 , wherein said antenna is selected from a group consisting of a meander-line antenna, a dipole antenna, a fractal antenna or an inverted F antenna (IFA). 
   
   
       14 . The method of  claim 11 , wherein said electronic apparatus is selected from a group consisting of a notebook computer, a personal digital assistant, an electronic dictionary or a wireless communication apparatus. 
   
   
       15 . The method of  claim 11 , wherein said patterned metal thin film is a metal conductor made of a material selected from the collection of copper, gold and silver. 
   
   
       16 . The method of  claim 11 , further comprising a step of electrically coupling said antenna to a radio frequency cable. 
   
   
       17 . The method of  claim 11 , wherein said injection process is an injection molding with an in-mode decoration (IMD) technology or an in-mode film decoration (IMF) technology.