Semiconductor Package With Rigid And Flexible Circuits

Abstract

The semiconductor package includes a rigid circuit board substrate having a substrate first side and an opposing substrate second side. The package also includes multiple electrical contacts coupled to the substrate at the substrate first side. An adhesive directly contacts the substrate second side. A semiconductor device directly contacts the adhesive. At least one flexible conductor is electrically connected to the semiconductor device and to at least one of the electrical contacts. The flexible conductor extends from the first side to the second side of the substrate.

1 . A semiconductor package, comprising:
 a rigid circuit board substrate having a substrate first side and an opposing substrate second side;   multiple electrical contacts coupled to said substrate at said substrate first side;   an adhesive in direct contact with said substrate second side;   a semiconductor device in direct contact with said adhesive; and   at least one flexible conductor electrically connected to said semiconductor device and to at least one of said electrical contacts, where the flexible conductor extends from the first side to the second side of the substrate.   
   
   
       2 . The semiconductor package of  claim 1 , wherein said substrate defines one or more vias extending at least partially there through. 
   
   
       3 . The semiconductor package of  claim 2 , wherein said semiconductor device comprises at least one semiconductor low-speed interface electrically coupled to at least one of said electrical contacts through at least one of said vias. 
   
   
       4 . The semiconductor package of  claim 1 , wherein said semiconductor device comprises at least one semiconductor high-speed interface electrically coupled to said at least one flexible conductor. 
   
   
       5 . The semiconductor package of  claim 1 , further comprising at least one electrical trace on said substrate second side, where said semiconductor device and said at least one flexible conductor are electrically coupled to said at least one electrical trace through one or more wire bonds. 
   
   
       6 . The semiconductor package of  claim 1 , wherein said semiconductor device is electrically coupled to said at least one flexible conductor through one or more wire bonds. 
   
   
       7 . The semiconductor package of  claim 1 , wherein said substrate is a multi-layer laminate circuit board. 
   
   
       8 . The semiconductor package of  claim 1 , wherein said substrate has a substrate first conductive layer at said substrate first side and a substrate second conductive layer at said substrate second side, where said substrate first conductive layer and said substrate second conductive layer are separated by a substrate insulation layer. 
   
   
       9 . The semiconductor package of  claim 1 , wherein said electrical contacts comprise an array of solder balls, solder lands or pins. 
   
   
       10 . The semiconductor package of  claim 1 , wherein said at least one flexible conductor is mechanically coupled to said substrate. 
   
   
       11 . The semiconductor package of  claim 1 , wherein said at least one flexible conductor is wrapped around an edge of said substrate between said substrate first side and said substrate second side. 
   
   
       12 . The semiconductor package of  claim 1 , wherein said at least one flexible conductor is flexible tape (flex-tape). 
   
   
       13 . The semiconductor package of  claim 1 , wherein said flexible conductor comprises at least two flexible conductor conductive layers separated by a flexible conductor insulation layer. 
   
   
       14 . The semiconductor package of  claim 13 , wherein at least one of said flexible conductor conductive layers is electrically coupled to said semiconductor device and to at least one of said electrical contacts. 
   
   
       15 . The semiconductor package of  claim 13 , wherein at least one of said flexible conductor conductive layers acts as a ground plane. 
   
   
       16 . The semiconductor package of  claim 1 , wherein said flexible conductor comprises:
 a flexible conductor first conductive layer electrically coupled to a semiconductor high-speed interface of said semiconductor device and to at least one of said electrically contacts;   a flexible conductor second conductive layer configured to act as a ground plane; and   a flexible tape insulation layer separating said flexible conductor first conductive layer and said flexible conductor second conductive layer.   
   
   
       17 . A semiconductor package, comprising:
 a rigid circuit board substrate having a substrate first side and an opposing substrate second side;   multiple electrical contacts coupled to said substrate at said substrate first side;   a semiconductor device in direct contact with said substrate at said substrate second side; and   at least one flexible conductor electrically coupled to said semiconductor device and to at least one of said electrical contacts, where the flexible conductor extends from the first side to the second side of the substrate.   
   
   
       18 . The semiconductor package of  claim 17 , wherein the semiconductor device comprises a plurality of electrical connectors, and the plurality of electrical connectors is in direct contact with said substrate at said substrate second side. 
   
   
       19 . The semiconductor package of  claim 18 , wherein said plurality of electrical connectors comprises a plurality of metal bumps. 
   
   
       20 . The semiconductor package of  claim 17 , wherein said substrate defines one or more vias extending at least partially there through. 
   
   
       21 . The semiconductor package of  claim 20 , wherein said semiconductor device comprises at least one semiconductor low-speed interface electrically coupled to at least one of said electrical contacts through at least one of said vias. 
   
   
       22 . The semiconductor package of  claim 17 , wherein said semiconductor device comprises at least one semiconductor high-speed interface electrically coupled to said at least one flexible conductor. 
   
   
       23 . The semiconductor package of  claim 17 , wherein said flexible conductor comprises:
 a flexible conductor first conductive layer electrically coupled to a semiconductor high-speed interface of said semiconductor device and to at least one of said electrically contacts;   a flexible conductor second conductive layer configured to act as a ground plane; and   a flexible tape insulation layer separating said flexible conductor first conductive layer an said flexible conductor second conductive layer.