Electronic device with dual function outer surface
Abstract
An outer portion of an electronic device has an uneven profile to aid in the dissipation of heat. Raised points in the uneven profile may be manufactured with a non-thermal conductive coating. In one implementation, the outer portion of the device includes a thermally conductive layer having an uneven surface and at least one other surface that is thermally coupled with a heat source. The uneven surface includes high areas that are higher than other areas of the uneven surface. A number of non-thermally conductive second layer areas are located on the high areas of the thermally conductive surface.
Claims
exact text as granted — not AI-modified1 . A device having an outer surface that comprises:
a thermally conductive layer having an uneven surface and at least one other surface that is thermally coupled to a heat source, the uneven surface including a plurality of first areas that are higher than other areas of the uneven surface; and a plurality of second layer areas located on the first areas of the uneven surface.
2 . The device of claim 1 , wherein the plurality of second layer areas are non-thermally conductive.
3 . The device of claim 1 , wherein the plurality of second layer areas include a plastic material or an elastomer.
4 . The device of claim 3 , wherein the thermally conductive layer includes a metal.
5 . The device of claim 1 , wherein the thermally conductive layer acts as a heat sink for the device.
6 . The device of claim 1 , wherein the uneven surface of the thermally conductive layer includes a wave like contour.
7 . The device of claim 1 , wherein the uneven surface of the thermally conductive layer includes a hill like or box like contour.
8 . The device of claim 1 , wherein the plurality of second layer areas are formed of a material that is relatively easy to grip.
9 . The device of claim 1 , wherein the first areas of the uneven surface are separated from lower areas of the uneven surface by a distance ranging from approximately 0.2 to on the order of a few millimeters.
10 . An electronic device comprising:
a heat source; and an outer surface portion that includes
a thermally conductive layer having an uneven surface and at least one other surface that is thermally coupled to the heat source, the uneven surface including a plurality of raised areas; and
a plurality of second layer areas located on the raised areas of the uneven surface.
11 . The electronic device of claim 10 , wherein the electronic device is a mobile terminal or a portable computer.
12 . The electronic device of claim 10 , wherein the second layer areas include non-thermally conductive areas.
13 . The electronic device of claim 12 , wherein the plurality of second layer areas each include a plastic material or an elastomer.
14 . The electronic device of claim 13 , wherein the thermally conductive layer includes a metal.
15 . The electronic device of claim 10 , wherein the uneven surface includes a wave like contour.
16 . The electronic device of claim 10 , wherein the uneven surface includes a hill like contour or a box like contour.
17 . The electronic device of claim 10 , wherein the plurality of second layer areas are formed of a material is relatively easy to grip.
18 . The electronic device of claim 10 , wherein the raised areas of the uneven surface are separated from low areas of the uneven surface by approximately 0.2 millimeters to on the order of a few millimeters.
19 . A dual function surface comprising:
means for dispersing heat, the means for dispersing heat having a thermally conductive uneven surface; and means for insulating portions of the uneven surface with a material that is relatively non-thermally conductive.
20 . The dual function surface of claim 19 , wherein the material has a high coefficient of friction and a pleasant tactile feel.
21 . The dual function surface of claim 19 , wherein the uneven surface has a wave like contour.Join the waitlist — get patent alerts
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