US2008149320A1PendingUtilityA1

Electronic device with dual function outer surface

Assignee: SONY ERICSSON MOBILE COMM ABPriority: Oct 19, 2006Filed: Oct 19, 2006Published: Jun 26, 2008
Est. expiryOct 19, 2026(~0.2 yrs left)· nominal 20-yr term from priority
G06F 1/203H05K 5/02H05K 5/0209H05K 7/20418
31
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Claims

Abstract

An outer portion of an electronic device has an uneven profile to aid in the dissipation of heat. Raised points in the uneven profile may be manufactured with a non-thermal conductive coating. In one implementation, the outer portion of the device includes a thermally conductive layer having an uneven surface and at least one other surface that is thermally coupled with a heat source. The uneven surface includes high areas that are higher than other areas of the uneven surface. A number of non-thermally conductive second layer areas are located on the high areas of the thermally conductive surface.

Claims

exact text as granted — not AI-modified
1 . A device having an outer surface that comprises:
 a thermally conductive layer having an uneven surface and at least one other surface that is thermally coupled to a heat source, the uneven surface including a plurality of first areas that are higher than other areas of the uneven surface; and   a plurality of second layer areas located on the first areas of the uneven surface.   
   
   
       2 . The device of  claim 1 , wherein the plurality of second layer areas are non-thermally conductive. 
   
   
       3 . The device of  claim 1 , wherein the plurality of second layer areas include a plastic material or an elastomer. 
   
   
       4 . The device of  claim 3 , wherein the thermally conductive layer includes a metal. 
   
   
       5 . The device of  claim 1 , wherein the thermally conductive layer acts as a heat sink for the device. 
   
   
       6 . The device of  claim 1 , wherein the uneven surface of the thermally conductive layer includes a wave like contour. 
   
   
       7 . The device of  claim 1 , wherein the uneven surface of the thermally conductive layer includes a hill like or box like contour. 
   
   
       8 . The device of  claim 1 , wherein the plurality of second layer areas are formed of a material that is relatively easy to grip. 
   
   
       9 . The device of  claim 1 , wherein the first areas of the uneven surface are separated from lower areas of the uneven surface by a distance ranging from approximately 0.2 to on the order of a few millimeters. 
   
   
       10 . An electronic device comprising:
 a heat source; and   an outer surface portion that includes
 a thermally conductive layer having an uneven surface and at least one other surface that is thermally coupled to the heat source, the uneven surface including a plurality of raised areas; and 
 a plurality of second layer areas located on the raised areas of the uneven surface. 
   
   
   
       11 . The electronic device of  claim 10 , wherein the electronic device is a mobile terminal or a portable computer. 
   
   
       12 . The electronic device of  claim 10 , wherein the second layer areas include non-thermally conductive areas. 
   
   
       13 . The electronic device of  claim 12 , wherein the plurality of second layer areas each include a plastic material or an elastomer. 
   
   
       14 . The electronic device of  claim 13 , wherein the thermally conductive layer includes a metal. 
   
   
       15 . The electronic device of  claim 10 , wherein the uneven surface includes a wave like contour. 
   
   
       16 . The electronic device of  claim 10 , wherein the uneven surface includes a hill like contour or a box like contour. 
   
   
       17 . The electronic device of  claim 10 , wherein the plurality of second layer areas are formed of a material is relatively easy to grip. 
   
   
       18 . The electronic device of  claim 10 , wherein the raised areas of the uneven surface are separated from low areas of the uneven surface by approximately 0.2 millimeters to on the order of a few millimeters. 
   
   
       19 . A dual function surface comprising:
 means for dispersing heat, the means for dispersing heat having a thermally conductive uneven surface; and   means for insulating portions of the uneven surface with a material that is relatively non-thermally conductive.   
   
   
       20 . The dual function surface of  claim 19 , wherein the material has a high coefficient of friction and a pleasant tactile feel. 
   
   
       21 . The dual function surface of  claim 19 , wherein the uneven surface has a wave like contour.

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