Structure of a heat dissipating module
Abstract
A heat dissipating module includes a plurality of heat dissipating fins stacking together in a parallel manner, a plurality of base boards soldering on the heat dissipating fins and a heat transfer duct running through the heat dissipating fins. Each of the dissipating fins has a first portion and a second portion which is formed by bending two sides of the first portion forwards in a vertical manner. The second portion on the same side is coupled to form a coupling surface which is soldered on the base boards. By incorporating the heat transfer duct a firmer heat dissipating module structure is formed.
Claims
exact text as granted — not AI-modified1 . A structure of a heat dissipating module, comprising:
a plurality of perforated heat dissipating fins stacking together in a parallel manner, each of the heat dissipating fins having a first portion and a second portion, the second portion being coupled closely to form a coupling surface; a heat transfer duct running through the heat dissipating fins; and a plurality of base boards bonding to the coupling surface formed on each of two sides of the heat dissipating fins by soldering to form a firm coupling between the heat dissipating fins and the base boards.
2 . The structure of the heat dissipating module of claim 1 , wherein the second portion is a flat plate formed by bending two opposite sides of the first portion forwards vertical to the first portion.
3 . The structure of the heat dissipating module of claim 1 , wherein the soldering of the base boards and the radiation fins is done by roll welding.
4 . The structure of the heat dissipating module of claim 1 , wherein the coupling surface formed by stacking the heat dissipating fins is a flat surface.
5 . The structure of the heat dissipating module of claim 1 , wherein the second portion is formed at a length same as the length of one side of the heat dissipating fins.
6 . The structure of the heat dissipating module of claim 1 , wherein the second portion is formed at a length smaller than the length of one side of the heat dissipating fins.
7 . The structure of the heat dissipating module of claim 1 , wherein the perforation is formed on the first portion of the heat dissipating fins.
8 . The structure of the heat dissipating module of claim 7 , wherein the perforation is one or more.
9 . The structure of the heat dissipating module of claim 8 , wherein the heat transfer duct is coupled tightly with the perforation.Join the waitlist — get patent alerts
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