US2008148570A1PendingUtilityA1
Structured thermal transfer article
Est. expiryNov 7, 2025(expired)· nominal 20-yr term from priority
H10W 40/30H10W 40/257H10W 40/254H10W 40/258F28F 13/18F28F 21/08Y10T29/49393
50
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Claims
Abstract
Structured thermal transfer article comprising a plurality of metal bodies and a plurality of interstitial elements disposed between and connecting the plurality of metal bodies to one another. The metal bodies comprise an inner portion comprising a first metal and an outer portion comprising an alloy comprising the first metal and a second metal. The interstitial elements comprise the alloy of the outer portion.
Claims
exact text as granted — not AI-modified1 . A method of forming a structured thermal transfer article comprising:
providing a production tool having a predetermined array of mold cavities, depositing a composition comprising a binder and a plurality of metal bodies onto said production tool, said metal bodies comprising an inner portion comprising a first metal having a melting temperature T mp1 , and an outer portion comprising a second metal having a melting temperature T mp2 ; and heating said composition to a temperature less than T mp1 and T mp2 to form an alloy comprising said first metal and said second metal that bonds said plurality of metal bodies to one another, wherein said bond forms a porous matrix.
2 . The method of claim 1 wherein said first metal is selected from the group consisting of aluminum, copper, silver, and alloys thereof.
3 . The method of claim 1 wherein said second metal is the group consisting of copper, silver, magnesium, and alloys thereof.
4 . The method of claim 1 wherein said first metal comprises copper and said second metal comprises silver.
5 . The method of claim 1 wherein said binder is selected from the group consisting of mineral oil, silicone oil, kerosene, and polyvinyl butyral.
6 . The method claim 1 wherein said metal bodies further comprise diamond.
7 . The method of claim 1 further comprising introducing a backing that said alloy comprising said first metal and said second metal form a bond with.
8 . The method of claim 7 , wherein said metal bodies are deposited on a surface of said backing before heating the composition.
9 . The method of claim 8 , wherein depositing said metal bodies on said surface of said backing comprises formation of said metal bodies by physical vapor deposition, plasma deposition, electroless plating, electrolytic plating, immersion plating, and combinations thereof.
10 . The method of claim 1 , wherein said metal bodies are randomly shaped bodies, selected from polyhedrons, flakes, chips, fibers, plates, cylinders, needles, and combinations thereof.Join the waitlist — get patent alerts
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