Method of mounting flexible circuit boards, and display device
Abstract
The present invention is a method of mounting flexible circuit boards including: electrode groups formed on an insulating substrate; terminal groups formed in the vicinity of at least one side of the insulating substrate in such a manner as to be connected to outside at the electrode ends of the electrode groups; and terminals to be connected to the terminal groups; and a plurality of flexible circuit boards equipped with driver circuits for inputting signals to the electrode groups via the terminals, wherein the method includes the step of mounting the flexible circuit boards on the insulating substrate in a manner that the flexible circuit boards share overlap regions with adjacent flexible circuit boards.
Claims
exact text as granted — not AI-modified1 . Method of mounting flexible circuit boards including: electrode groups formed on an insulating substrate; terminal groups formed in the vicinity of at least one side of the insulating substrate in such a manner as to be connected to outside at the electrode ends of the electrode groups; and terminals to be connected to the terminal groups; and a plurality of flexible circuit boards equipped with driver circuits inputting signals to the electrode groups via the terminals, wherein said method includes the step of mounting the flexible circuit boards on the insulating substrate in such a manner that the flexible circuit boards share overlap regions and have physical contacts in said overlap regions with adjacent flexible circuit boards.
2 - 5 . (canceled)
6 . A display device comprising:
electrode groups formed on an insulating substrate, terminal groups formed in the vicinity of at least one side of the insulating substrate in such a manner as to be connected to outside at the electrode ends of the electrode groups, driver circuits for inputting the signals to the electrode groups via terminals to be connected to the terminal groups and the terminals, and a plurality of flexible circuit boards mounted on the mounted on the insulating substrate, wherein a part of linearly extended sides of any one of said flexible circuit boards share overlap in a region where said one of said one of said flexible circuit boards is overlapped with said insulating substrate and another region where said one of said flexible circuit boards is not overlapped with said insulating substrate with adjacent flexible circuit boards which are adjacent to said one of said flexible circuit boards.
7 - 10 . (canceled)
11 . The method of claim 1 , wherein said flexible circuit boards have common signal lines.
12 . The device of claim 6 , wherein said flexible circuit boards have common signal lines.Join the waitlist — get patent alerts
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