Semiconductor device and method of manufacturing semiconductor device

Abstract

The present invention provides a semiconductor device that is inexpensive and can suppress signal transmission delay, and a manufacturing method thereof. The semiconductor device includes: a plurality of semiconductor chips; a semiconductor substrate that has, on the same surface thereof, a chip-to-chip interconnection for electrically connecting the plurality of semiconductor chips to each other, and a plurality of chip-connection pads connected to the chip-to-chip interconnection; and a wiring board that has a plurality of lands of which pitch is larger than a pitch of the chip-connection pads, wherein a major surface of each of the plurality of semiconductor chips is connected to the chip-connection pads via a first connector so that the plurality of semiconductor chips are mounted on the semiconductor substrate, and an external-connection pad is formed on the major surface other than a region facing the semiconductor substrate, and is connected to the land on the wiring board via a second connector.

1 . A method of manufacturing a semiconductor device, comprising the steps of:
 forming a chip-to-chip interconnection and a plurality of chip-connection pads connected to the chip-to-chip interconnection on the same surface of a semiconductor substrate;   forming a plurality of external-connection pads on a major surface of a plurality of semiconductor chips other than a region facing the semiconductor substrate, the external-connection pads having a pitch larger than a pitch of the chip-connection pads;   forming a plurality of lands on a wiring board, the lands having a pitch equal to the pitch of the external-connection pads;   connecting the major surface of each of the plurality of semiconductor chips to the chip-connection pads on the semiconductor substrate via a first connector, to thereby mount the plurality of semiconductor chips on the semiconductor substrate; and   connecting the external-connection pads on the semiconductor chips to the lands on the wiring board via a second connector.   
   
   
       2 . The method of manufacturing a semiconductor device according to  claim 1 , wherein
 before mounting of the semiconductor chips on the semiconductor substrate, the semiconductor substrate is mounted on the wiring board or placed in the wiring board so that the chip-connection pads are exposed on the same side as a surface of the wiring board, the surface having the lands thereon.