Substrate Laser Marking

Abstract

A method for forming a feature in a substrate, where residue within the feature can be easily removed. An upper sidewall portion of the feature is formed, where the upper sidewall portion forms a void in the substrate. The upper sidewall portion has an upper sidewall angle. A lower sidewall portion of the feature is formed, where the lower sidewall portion forms a void in the substrate. The lower sidewall portion has a lower sidewall angle. The upper sidewall angle of the upper sidewall portion is shallower than the lower sidewall angle of the lower sidewall portion. By forming the feature with a shallower sidewall angle at the top of the feature, any debris within the feature is more susceptible to rinsing, etching, or other cleaning procedures, and thus the feature is more easily cleaned than standard features having relatively steeper sidewalls.

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       20 . Identifying indicia on a substrate, the identifying indicia formed with a pattern of indicia elements, where the indicia elements have a shape that aids in removal of foreign material from the indicia elements on the substrate, each indicia element forming a blind bore in the substrate, and having a sidewall with an upper sidewall portion having an upper sidewall angle and a lower sidewall portion having a lower sidewall angle, where the upper sidewall angle is shallower than the lower sidewall angle, and having a depth of no more than about twelve microns.