US2008135211A1PendingUtilityA1

Heat-Exchanger Device and Cooling System

Assignee: YASSOUR YUVALPriority: Jul 15, 2004Filed: Jul 14, 2005Published: Jun 12, 2008
Est. expiryJul 15, 2024(expired)· nominal 20-yr term from priority
Inventors:Yuval Yassour
H10W 72/877H10W 40/47F28D 2021/0029F28D 1/0476F28F 7/02F28D 1/0475
45
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Claims

Abstract

A heat-exchanging device comprising a heat exchanging layer, having a heat transfer contact surface designed to be subjected to a heat flux of a heat dissipating element and flow passages whose inlets and outlets are located on at least a first active surface that is substantially opposite the heat transfer contact surface; a manifold comprising a housing with a top cover, and alternating supply and evacuation substantially parallel channels, the channels having openings on a second active surface for fluidically communicating with the first active surface of the hear exchanging layer, each channel having at least another opening for coolant supply or for evacuating the coolant from the device. When the manifold and the heat exchanging layer are coupled and coolant fluid is supplied through the manifold, local U-shaped flow patterns are established in the heat exchanging layer, towards and away from the heat transfer contact surface in a local manner.

Claims

exact text as granted — not AI-modified
1 . A heat-exchanging device comprising:
 a heat exchanging layer, made from heat conducting material, having a heat transfer contact surface designed to be subjected to a heat flux of a heat dissipating element and flow passages whose inlets and outlets are located on at least a first active surface that is substantially opposite the heat transfer contact surface;   a manifold comprising a housing with a top cover, and alternating supply and evacuation substantially parallel channels, the channels having openings on a second active surface for fluidically communicating with the first active surface of the hear exchanging layer, each channel having at least another opening for coolant supply or for evacuating the coolant from the device;   whereby when the manifold and the heat exchanging layer are coupled and coolant fluid is supplied through the manifold, local U-shaped flow patterns are established in the heat exchanging layer, towards and away from the heat transfer contact surface in a local manner.   
   
   
       2 . The device of  claim 1 , wherein at least a portion of the heat exchanging layer and at least a portion of the manifold are integrated in one block. 
   
   
       3 . The device of  claim 1 , wherein the heat-conducting material is selected from the group of materials containing Aluminum and Copper. 
   
   
       4 . The device of  claim 1 , wherein the coolant fluid is selected from the group containing: gas, air, liquid, water and two-phase fluid. 
   
   
       5 . The device of  claim 1 , wherein the coolant fluid is pre-cooled. 
   
   
       6 . The device of  claim 1 , wherein supply channels of the manifold are connected to a high-pressure coolant fluid supply. 
   
   
       7 . The device of  claim 6 , wherein evacuation openings are located on the top cover, for exhausting hot coolant fluid away from the device. 
   
   
       8 . The device of  claim 6 , wherein the manifold is connected to the high-pressure supply from one or more sides of the housing. 
   
   
       9 . The device of  claim 1 , wherein evacuation channels of the manifold are connected to a low-pressure source for suction of the surrounding coolant fluid. 
   
   
       10 . The device of  claim 9 , wherein openings of supply channels are located on the top cover for receiving fresh coolant fluid from the surroundings. 
   
   
       11 . The device of  claim 9 , wherein the manifold is connected to the low-pressure source from one or more sides of the housing. 
   
   
       12 . The device of  claim 1 , wherein the coolant fluid is supplied to the manifold from a first side of the manifold and evacuated from a second side of the manifold. 
   
   
       13 . The device of  claim 1 , wherein a driving source for providing pressure differences to drive the coolant fluid through the device are selected from the group containing: fan, diagonal fan, blower, pump, compressor, vacuum pump. 
   
   
       14 . The device of  claim 1 , wherein the heat exchanging layer comprises a block having a plurality of U-shaped cooling tubes provided in it, each of the cooling tubes having an inlet section for receiving an inflow of the coolant fluid, an outlet section, substantially parallel to the inlet section, for evacuating the coolant fluid, and a connecting section in between, the inlet and the outlet of each cooling tubes are distributed on said at least first active surface,
 whereby when the manifold and the heat exchanging layer are coupled and coolant fluid is supplied through the manifold, the coolant fluid passes through the plurality of U-shaped tubes towards and away from the heat transfer contact surface in a local manner.   
   
   
       15 . The device of  claim 14 , wherein the active surfaces are staggered, whereby the inlets of the cooling tubes and the outlets of the cooling tubes are located at two planes of the first active surface, one of said planes is elevated in relation to the second plane. 
   
   
       16 . The device of  claim 14 , wherein the inlet sectors of the cooling tubes are of different length in relation to the outlet sectors of the cooling tubes. 
   
   
       17 . The device of  claim 14 , wherein the cooling tubes have a diameter that is not greater than 1 mm. 
   
   
       18 . The device of  claim 14 , wherein the cooling tubes have a height that is not greater than 10 mm. 
   
   
       19 . The device of  claim 14 , wherein the total area taken by the inlets and outlets of the cooling tubes amounts between 50 to 85 percent of the total area of the first active surface. 
   
   
       20 . The device of  claim 14 , wherein the block is made from at least two adjacent sub-layers, a first sub-layer comprising a plurality of passing through tubes creating the inlet and outlet sections of each cooling tube, and a second sub-layer comprising a plurality of basins which are the connecting sections of the cooling tubes. 
   
   
       21 . The device of  claim 14 , wherein inlets and outlets of the cooling tubes are arranged in alternating rows. 
   
   
       22 . The device of  claim 14 , wherein inlets and outlets of the cooling tubes are arranged in adjacent two rows arranged in a mirror symmetry. 
   
   
       23 . The device of  claim 14 , wherein inlets and outlets are arranged in a staggered formation. 
   
   
       24 . The device of  claim 23 , wherein pairs of inlets of cooling-tubes are adjacent and fluidically communicating with a supply channel of the manifold and pairs of outlets of cooling-tubes are adjacent and fluidically communicating with an evacuation channel of the manifold. 
   
   
       25 . The device of  claim 14 , wherein the cooling-tubes are distributed on the active surface at varying densities. 
   
   
       26 . The device of  claim 14 , wherein the cooling tubes have elongated inlets and outlets sections. 
   
   
       27 . The device of  claim 26 , wherein one or more connecting sections connect the inlet and the outlet sections of each cooling tube. 
   
   
       28 . The device of  claim 14 , wherein the connecting sections of the heat exchanging layer comprise a plurality of channels, each of the channels fluidically communicating with a row of inlet and outlet sections of a row of cooling tubes, whereby local, aerodynamically separated, U-shaped flow patterns are established in the heat exchanging layer when coolant fluid is passed through. 
   
   
       29 . The device of  claim 1 , wherein the heat exchanging layer comprises a plurality of exposed U-shaped cooling tubes, the inlet and the outlet of each cooling tubes are distributed on said at least first active surface,
 whereby when the manifold and the heat exchanging layer are coupled and coolant fluid is supplied through the manifold, the coolant fluid passes through the plurality of U-shaped tubes facilitating cooling of a fluidic medium to which the device is exposed.   
   
   
       30 . The device of  claim 1 , wherein the heat exchanging layer comprises a plurality of substantially parallel elongated cooling fins defining a plurality of substantially parallel elongated cooling channels with elongated openings facing the second active surface of the manifold, whereby when the manifold and the heat exchanging layer are coupled and coolant fluid is supplied through the manifold, local, aerodynamically separated, U-shaped flow patterns are established in the heat exchanging layer, towards and away from the heat transfer contact surface in local manner. 
   
   
       31 . The device of  claim 30 , wherein the channels of the manifold are substantially orthogonal to the cooling fins of the heat exchanging layer. 
   
   
       32 . The device of  claim 30 , wherein the heat exchanging layer of the device is integrated with a heat spreader of a heat dissipating device. 
   
   
       33 . The device of  claim 30 , wherein the heat exchanging layer of the device is integrated with a surface of a heat dissipating device. 
   
   
       34 . The device of  claim 30 , wherein the height of the cooling fins and the depth of the cooling channels are in the range between 0.1 to a few millimeters. 
   
   
       35 . The device of  claim 30 , wherein the density of the cooling fins is in the range between 5 to 100 fins per cm. 
   
   
       36 . The device of  claim 30 , wherein the density of the manifold channels is in the range between 50 to 5 percent of the density of the cooling fins. 
   
   
       37 . The device of  claim 30 , wherein the height of the manifold channels is in the range between 2 to 20 millimeters.

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