Polishing composition and polishing method

Abstract

A polishing composition contains alumina, a complexing agent, and an oxidizing agent. It is preferable that the complexing agent is at least one compound selected from an α-amino acid, ammonia, and an ammonium salt. The polishing composition is preferably used in applications for polishing an object having a resin section with a trench, and a conductor layer provided on the resin section so that at least the trench is filled with the conductor layer.

1 - 20 . (canceled) 
   
   
       21 . A polishing method comprising:
 preparing a polishing composition including alumina, a complexing agent, and an oxidizing agent; and   polishing an object having a resin section with a trench, and a conductor layer provided on the resin section so that at least the trench is filled with the conductor layer, by using the prepared polishing composition.   
   
   
       22 . The method according to  claim 21 , wherein the resin section is a resin layer provided on a substrate. 
   
   
       23 . The method according to  claim 21 , wherein the complexing agent includes at least one compound selected from an α-amino acid, ammonia, and an ammonium salt. 
   
   
       24 . The method according to  claim 21 , wherein the complexing agent includes an α-amino acid and at least one compound selected from ammonia and an ammonium salt. 
   
   
       25 . The method according to  claim 24 , wherein the complexing agent includes glycine or alanine and ammonia. 
   
   
       26 . The method according to  claim 21 , the polishing composition further contains alumina sol. 
   
   
       27 . The method according to  claim 21 , wherein a pH of the polishing composition is 7 or more. 
   
   
       28 . A polishing method comprising:
 preparing a polishing composition including alumina, an α-amino acid, ammonia or an ammonium salt, hydrogen peroxide, alumina sol, and water; and   polishing an object having an insulating resin section with a trench, and a copper conductor layer provided on the resin section so that at least the trench is filled with the conductor layer, by using the prepared polishing composition.