Cmp conditioner

Abstract

To provide a CMP conditioner that prevents dissolution of metals in slurry, without the chipping of the abrasive grains and/or decreasing the cutting performance. The CMP apparatus has a polishing pad that faces and contacts conditioning surface of the conditioner body. On this conditioning surface, abrasive grains are distributed and fixed to form abrasive grain layer, thus forming the CMP conditioner. The conditioner body is made of ceramics, the abrasive grains in the abrasive grain layer are held by binding phase made of low temperature co-fired ceramics.

1 . A CMP conditioner comprising:
 a conditioner body facing and contacting a polishing pad of a CMP apparatus, and   an abrasive grain layer formed on a conditioning surface of the conditioning body, wherein abrasive grains are distributed and adhered on the abrasive grain layer,   wherein the conditioner body is made of ceramics and   wherein a binding phase holding the abrasive grains in the abrasive grain layer is made of low temperature co-fired ceramics.   
   
   
       2 . The CMP conditioner according to  claim 1 , wherein the conditioner body is made of low temperature co-fired ceramics. 
   
   
       3 . The CMP conditioner according to  claim 1 , wherein the low temperature co-fired ceramics is MgO—SiO 2  ceramics. 
   
   
       4 . The CMP conditioner according to  claim 1 , further comprising a chassis made of resin supporting sections other than the conditioning surface of the conditioner body.