US2008131683A1PendingUtilityA1

Aerogel/PTFE Composite Insulating Material

Assignee: RISTIC-LEHMANN CEDOMILAPriority: Nov 10, 2003Filed: Jan 10, 2008Published: Jun 5, 2008
Est. expiryNov 10, 2023(expired)· nominal 20-yr term from priority
H10W 40/77B29C 65/48H04M 1/0214Y10T428/249924B32B 2307/7242B32B 27/08F28F 2270/00B32B 27/18B32B 15/20B29K 2075/00B29K 2069/00B29L 2031/4864Y10T428/31786B32B 2327/18B32B 2307/304F16L 59/028B29C 66/73113Y10T428/25Y10T428/31678B32B 2260/00B29K 2105/0085B29C 63/08B29C 66/45B32B 2307/7265B29C 66/727B29L 2023/225B29K 2077/00C08K 3/22Y10T428/31544H05K 1/034B29C 66/729Y10T428/31725B32B 15/08G06F 1/203B29K 2995/0065B29K 2021/003B29L 2009/00B32B 2307/206Y10T428/31551B32B 2405/00H04M 1/026B29K 2067/00B29C 66/82661B32B 7/12B29C 66/001B32B 5/18B29L 2031/3431B29K 2995/0092C08K 3/36B29C 66/71B29K 2027/18H05K 1/0373B29K 2995/0015B29K 2083/00B29C 66/721A41D 19/01529
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Claims

Abstract

A material comprising aerogel particles and a polytetrafluoroethylene (PTFE) binder is formed having a thermal conductivity of less than or equal to 25 mW/m K at atmospheric conditions. The material is moldable or formable, having little or no shedding of filler particles, and may be formed into structures such as tapes or composites, for example, by bonding the material between two outer layers. Advantageously, composites may be flexed, stretched, or bent without significant dusting or loss of insulating properties.

Claims

exact text as granted — not AI-modified
1 . A method comprising the steps of providing a portable electronic device having at least one heat generating component and an enclosure having a surface, and placing an insulating structure between the heat generating component and the enclosure, thereby preventing or delaying the transfer of heat generated from a heat generating component to at least a portion of the enclosure surface. 
   
   
       2 . The method of  claim 1  wherein the insulating structure comprises a material comprising aerogel particles and a polytetrafluoroethylene (PTFE) binder, the material having a thermal conductivity of less than or equal to 25 mW/m K at atmospheric conditions (about 298.15 K and 101.3 kPa). 
   
   
       3 . The method of  claim 1  wherein at least part of the enclosure surface is designed to be in direct contact with a user.

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