Heat spreader for a multi-chip package

Abstract

Embodiments of a heat spreader and an assembly including such a heat spreader are disclosed. The heat spreader includes a stiffening member, which in one embodiment comprises a wall extending from a lower surface of the heat spreader. The wall may be coupled with a substrate, and the addition of this wall may decrease warpage of the substrate and increase package stiffness. The wall may be located between adjacent integrated circuit die that are disposed on the substrate. Other embodiments are described and claimed.

1 . A heat spreader comprising:
 a body formed of a thermally conductive material, the body including a surface having a first region to mate with a first die and a second region to mate with a second die; and   a wall disposed between the first and second regions and extending from the surface.   
   
   
       2 . The heat spreader of  claim 1 , further comprising a lip disposed about at least a portion of a periphery of the body, the lip extending from the surface. 
   
   
       3 . The heat spreader of  claim 2 , wherein the wall extends between opposing sides of the lip. 
   
   
       4 . The heat spreader of  claim 1 , wherein the first region is vertically offset relative to the second region to compensate for a height difference between the first die and the second die. 
   
   
       5 . The heat spreader of  claim 1 , further comprising:
 a third region on the surface of the body to mate with a third die; and   a second wall disposed between the second and third regions and extending from the surface.   
   
   
       6 . The heat spreader of  claim 1 , further comprising at least one vent disposed in the heat spreader body. 
   
   
       7 . The heat spreader of  claim 1 , wherein the thermally conductive material comprises copper. 
   
   
       8 . An assembly comprising:
 a substrate;   a first die coupled with the substrate;   a second die coupled with the substrate; and   a heat spreader thermally coupled with a surface of the first die and with a surface of the second die, the heat spreader including a wall extending toward the substrate at a location between the first die and the second die, wherein the wall is coupled with the substrate.   
   
   
       9 . The assembly of  claim 8 , wherein the wall is coupled with the substrate by a layer of an adhesive. 
   
   
       10 . The assembly of  claim 8 , wherein the heat spreader further includes a lip extending about at least a portion of a periphery of the heat spreader, the lip coupled with the substrate. 
   
   
       11 . The assembly of  claim 10 , wherein the wall extends between opposing sides of the lip. 
   
   
       12 . The assembly of  claim 8 , wherein a surface of the heat spreader facing the first die and the second die is contoured to compensate for a height different between the first die and the second die. 
   
   
       13 . The assembly of  claim 8 , further comprising:
 at least one other die coupled with the substrate, wherein the heat spreader is thermally coupled with a surface of the other die;   wherein the heat spreader further includes a second wall extending toward the substrate at a location between the second die and the one other die.   
   
   
       14 . The assembly of  claim 8 , further comprising a layer of a thermal interface material disposed between the heat spreader and the first die and a layer of a thermal interface material disposed between the heat spreader and the second die. 
   
   
       15 . The assembly of  claim 8 , wherein the heat spreader further comprises at least one vent. 
   
   
       16 . The assembly of  claim 8 , wherein the heat spreader comprises copper.