Non-Volatile Memory Including Insulated Gate Bipolar Transistors And Charge Trapping Layer Containing Silicon and Nitrogen
Abstract
A memory block of a semiconductor memory array where the semiconductor memory array is a NOR array, a NAND array, or an AND array includes a bit line, memory cells where each memory cell has a floating gate including a charge trapping layer containing silicon and nitrogen, a metal-oxide-semiconductor select transistor that separates said bit line and said memory cells, a semiconductor region enclosed within the drain of said select transistor with a conductivity type that is opposite to that of said drain, and a semiconductor well region shared by said select transistor and said memory cells.
Claims
exact text as granted — not AI-modified1 . A memory block of a semiconductor memory array, the semiconductor memory array being a NOR array, a NAND array, or an AND array, the memory block comprising:
a bit line; memory cells, each memory cell having a floating gate comprising a charge trapping layer containing silicon and nitrogen; a metal-oxide-semiconductor select transistor that separates said bit line and said memory cells; a semiconductor region enclosed within the drain of said select transistor with a conductivity type that is opposite to that of said drain; and a semiconductor well region shared by said select transistor and said memory cells.
2 . The memory block of claim 1 wherein said charge trapping layer comprises a multilayer charge trapping medium containing nanocrystals.
3 . The memory block of claim 1 , further comprising means to electrically connect said semiconductor region and said drain.
4 . The memory block of claim 3 , wherein said means comprises a metal-oxide-semiconductor transistor capable of being set to the on or off state independent of the state of said select transistor.
5 . The memory block of claim 3 , wherein said means comprises a resistor.
6 . The memory array of claim 3 , wherein said memory array is built with a semiconductor manufacturing process which uses more than one well.
7 . The memory array of claim 3 , wherein said memory array is built with a silicon-on-insulator technology.
8 . A memory block of a semiconductor memory array of a NAND type, the memory block comprising:
a bit line; memory cells, each memory cell having a floating gate comprising a charge trapping layer containing silicon and nitrogen; a metal-oxide-semiconductor select transistor that separates said bit line and said memory cells; a semiconductor region enclosed within the drain of said select transistor with a conductivity type that is opposite to that of said drain; and a semiconductor well region shared by said select transistor and said memory cells.
9 . The memory block of claim 8 wherein said charge trapping layer comprises a multilayer charge trapping medium containing nanocrystals.
10 . The memory block of claim 8 , further comprising means to electrically connect said semiconductor region and said drain.
11 . The memory block of claim 10 , wherein said means comprises a metal-oxide-semiconductor transistor capable of being set to the on or off state independent of the state of said select transistor.
12 . The memory block of claim 10 , wherein said means comprises a resistor.
13 . The memory array of claim 10 , wherein said memory array is built with a semiconductor manufacturing process which uses more than one well.
14 . The memory array of claim 10 , wherein said memory array is built with a silicon-on-insulator technology.Join the waitlist — get patent alerts
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