Method of making high speed interposer

Abstract

A method of making a high speed interposer which includes a substrate having alternatingly oriented dielectric and conductive layers which form a substrate, openings which extend from one opposing surface of the substrate to a second opposing surface, conductive members positioned within the openings and also extending from surface to surface (and beyond, in some embodiments), and a plurality of shielding members positioned substantially around the conductive members to provide shielding therefore during the passage of high frequency signals through the conductive members.

1 . A method of making an interposer, said method comprising:
 providing a substrate including first and second opposing surfaces and including a plurality of dielectric layers and a plurality of conductive layers oriented within said substrate in an alternating manner with respect to said plurality of said dielectric layers;   forming a plurality of openings within said substrate which extend substantially through said substrate from said first opposing surface to said second opposing surface;   providing a conductive member within each of said openings which extends substantially from said first opposing surface of said substrate to said second opposing surface of said substrate; and   forming a plurality of shielding members within said substrate which each extend substantially from said first opposing surface of said substrate to said second opposing surface of said substrate and is positioned substantially around a respective one of said conductive members at a spaced distance there-from, each of said shielding members being adapted for providing shielding for a respective one of said conductive members during the passage of high frequency signals through said conductive member.   
     
     
         2 . The method of  claim 1  wherein said plurality of openings is formed within said substrate using a drilling operation. 
     
     
         3 . The method of  claim 2  wherein said drilling operation is accomplished using mechanical or laser drilling. 
     
     
         4 . The method of  claim 1  wherein said shielding members are formed using a plating operation, said plating operation comprising forming a conductive layer on each of said openings. 
     
     
         5 . The method of  claim 4  further including substantially filling each of said openings with a dielectric composition following said plating operation. 
     
     
         6 . The method of  claim 5  further including thereafter forming a second opening within each of said dielectric compositions within said substantially filled openings having said conductive layer thereon and thereafter positioning a pin within said second opening, said pins being said conductive members. 
     
     
         7 . The method of  claim 5  further including forming at least one cover on one end of each of said substantially filled openings. 
     
     
         8 . The method of  claim 5  further including thereafter forming a second opening within each of said dielectric compositions within said substantially filled openings having said conductive layer thereon and thereafter positioning a quantity of conductive material within said second opening. 
     
     
         9 . The method of  claim 8  further including forming a conducting layer on each of said second openings prior to said positioning of said quantity of said conductive material within said second opening. 
     
     
         10 . The method of  claim 9  wherein each of said conducting layers are formed using a plating operation.