Method for manufacturing open cell microporous metal

Abstract

Disclosed is a method of manufacturing an open cell porous metal, including the steps of mixing a target metal with a low melting point material, having a melting point lower than that of the target metal, to form a mixture; forming a compact by pressurizing the mixture; forming a sintered compact, which open cell micropores are formed, by sintering and polishing the compact; and plating the sintered compact. The present invention has advantages in that pores are easily formed, and the form of the pores can be variously adjusted. Further, the open cell porous metal manufactured by the present invention has an advantage in that the open cell porous metal has various effects or characteristics such as durability, sound-absorbing property, heat resistance, electromagnetic wave blocking, high damping property, high strength, ultra-lightweight, fragrance emission, and fragrance retention, and can thus be used as a functional metal for various uses.

1 . A method of manufacturing an open cell porous metal, comprising the steps of:
 mixing a target metal with a low melting point material having a melting point lower than that of the target metal to form a mixture;   forming a compact by pressurizing the mixture;   forming a sintered compact, in which open cell micropores are formed, by sintering and polishing the compact; and   plating the sintered compact.   
     
     
         2 . The method according to  claim 1 , wherein a mixing ratio of the target metal to the low melting point material ranges from 7:3 to 9.95:0.05. 
     
     
         3 . The method according to  claim 1 , wherein the low melting point material has a melting point of 200˜600° C. 
     
     
         4 . The method according to  claim 1 , wherein, in the step of sintering, the open cell micropores are formed in the compact by melting only the low melting point material. 
     
     
         5 . The method according to  claim 4 , wherein, in the step of sintering, the low melting point material is melted at a temperature of 200˜3500° C. in an ammonia cracking reductive atmosphere or a vacuum atmosphere. 
     
     
         6 . The method according to  claim 1 , wherein, in the step of plating, a corrosion inhibition film is plated using a dry plating method.