Fluid pump

Abstract

Fluid pump ( 10 ) comprises a casing provided with a partition separating a pump chamber and a housing chamber. Impeller ( 43 ) is disposed within the pump chamber. Stator ( 33 ), semiconductor device ( 25 ), terminal ( 37 ), and sheet member ( 29 a ) are disposed within the housing chamber. Terminal ( 37 ) electrically connects the semiconductor device to the stator. Sheet member ( 29 a ) may have rubber elasticity. Preferably, the sheet member has s a first plane surface, which makes contact in a planar manner with the semiconductor device, and a second plane surface which makes contact in a planar manner with the partition of the casing.

1 . A fluid pump comprising:
 a casing provided with a pump chamber, a housing chamber, and a partition separating the pump chamber and the housing chamber;   an impeller rotatably disposed within the pump chamber;   a stator disposed within the housing chamber, the stator generating driving force for driving the rotation of the impeller;   a first semiconductor device disposed within the housing chamber;   a terminal disposed within the housing chamber, the terminal electrically connecting the first semiconductor device to the stator; and   a first sheet member disposed within the housing chamber, the first sheet member having rubber elasticity, the first sheet member comprising a first plane surface and a second plane surface, the first plane surface making contact in a planar manner with the first semiconductor device, and the second plane surface making contact in a planar manner with the partition of the casing.   
   
   
       2 . The fluid pump as in  claim 1 , wherein the first semiconductor device is disposed facing the partition of the casing. 
   
   
       3 . The fluid pump as in  claim 2 , wherein the first sheet member has a third plane surface making contact in a planar manner with the terminal. 
   
   
       4 . The fluid pump as in  claim 3 , further comprising a substrate disposed within the housing chamber, wherein the first semiconductor device is mounted on the substrate, the terminal has a first end, a second end, and a central part between the first end and the second end, the first end is fixed to the stator, the second end is fixed to the substrate, and the first sheet member makes contact in a planar manner with the central part of the terminal. 
   
   
       5 . The fluid pump as in  claim 4 , further comprising an electric part mounted on the substrate, and a second sheet member disposed within the housing chamber, wherein the second sheet member has rubber elasticity, the second sheet member comprises a third plane surface and a fourth plane surface, the third plane surface makes contact in a planar manner with the electric part, and the fourth plane surface makes contact in a planar manner with the partition of the casing. 
   
   
       6 . The fluid pump as in  claim 5 , wherein the first sheet member is formed from silicon resin. 
   
   
       7 . The fluid pump as in  claim 1 , further comprising a heat insulating plate disposed within the housing chamber, wherein the heat insulating plate divides the housing chamber into a stator side and a first semiconductor device side, and the stator is surrounded by the partition and the heat insulating plate. 
   
   
       8 . The fluid pump as in  claim 7 , wherein the heat insulating plate is disposed near an end side of the stator. 
   
   
       9 . The fluid pump as in  claim 8 , wherein potting material is filled into only a space at the stator side of the housing chamber. 
   
   
       10 . The fluid pump as in  claim 1 , further comprising a substrate, a second sheet member, and a second semiconductor device, wherein
 the substrate is disposed within the housing chamber,   the second sheet member is disposed within the housing chamber, the second sheet member having rubber elasticity, the second sheet member comprising a fourth plane surface and a fifth plane surface, the fourth plane surface making contact in a planar manner with a surface at the pump chamber side of the substrate, and the fifth plane surface making contact in a planar manner with the partition of the casing, and   the second semiconductor device is mounted on an opposite surface of the substrate from the pump chamber side, at a position corresponding to the location where the substrate is making contact with the fourth plane surface of the second sheet member.   
   
   
       11 . The fluid pump as in  claim 10 , wherein the first semiconductor device is mounted on a pump chamber side surface of the substrate, and first end of the terminal is fixed to the substrate, the second end of the terminal is fixed to the stator. 
   
   
       12 . A fluid pump comprising:
 a casing provided with a pump chamber, a housing chamber, and a partition separating the pump chamber and the housing chamber;   an impeller rotatably disposed within the pump chamber;   a substrate disposed within the housing chamber,   a stator disposed within the housing chamber, the stator generating driving force for driving the rotation of the impeller;   a semiconductor device mounted on an opposite surface of the substrate from the pump chamber side;   a terminal disposed within the housing chamber, wherein a first end of the terminal is fixed to the substrate, and a second end of the terminal is fixed to the stator; and   a sheet member disposed within the housing chamber, the sheet member having rubber elasticity, the sheet member comprising a first plane surface and a second plane surface, the first plane surface making contact in a planar manner with a surface at the pump chamber side of the substrate, and the second plane surface making contact in a planar manner with the partition of the casing, wherein   the semiconductor device is disposed at a position corresponding to the location where the substrate is making contact with the first plane surface of the sheet member.   
   
   
       13 . The fluid pump as in  claim 12 , wherein the sheet member has a third plane surface making contact in a planar manner with the terminal. 
   
   
       14 . The fluid pump as in  claim 13 , wherein the terminal has a central part between the first end and the second end, and the sheet member makes contact in a planar manner with the central part of the terminal. 
   
   
       15 . The fluid pump as in  claim 14 , wherein the sheet members is formed from silicon resin. 
   
   
       16 . A fluid pump comprising:
 a casing provided with a pump chamber, a housing chamber, and a partition separating the pump chamber and the housing chamber;   an impeller rotatably disposed within the pump chamber;   a stator disposed within the housing chamber, the stator generating driving force for driving the rotation of the impeller;   a semiconductor device disposed within the housing chamber, the semiconductor device being electrically connected to the stator; and   a heat insulating plate disposed within the housing chamber, wherein the heat insulating plate divides the housing chamber into a stator side and a semiconductor device side, and the stator is surrounded by the partition and the heat insulating plate.   
   
   
       17 . The fluid pump as in  claim 16 , wherein the heat insulating plate is disposed near an end side of the stator. 
   
   
       18 . The fluid pump as in  claim 17 , wherein potting material is filled into only a space at the stator side of the housing chamber. 
   
   
       19 . The fluid pump as in  claim 18 , further comprising a sheet member disposed within the housing chamber, the sheet member having rubber elasticity, the sheet member comprising a first plane surface and a second plane surface, the first plane surface making contact in a planar manner with the semiconductor device, and the second plane surface making contact in a planar manner with the partition of the casing. 
   
   
       20 . The fluid pump as in  claim 19 , wherein the sheet member is formed from silicon resin.