Solventless liquid isoprene compounds

Abstract

In one embodiment, this invention relates to a solventless liquid isoprene compound. The compound includes a liquid isoprene rubber. The compound also includes a curing agent selected from sulfur and/or sulfur donors. The curing agent is present in an amount of at least about 3% by weight of the compound. The compound contains substantially no solvent. In another embodiment, this invention relates to a solventless liquid isoprene compound. The compound includes a liquid isoprene rubber. The compound also includes a nonsulfur curing agent. The curing agent is present in an amount of at least about 5% by weight of the compound. The compound contains substantially no solvent.

1 . A solventless liquid isoprene compound comprising: 
 a liquid isoprene rubber, polymer molecules thereof having a backbone consisting of polyisoprene; and    a curing agent selected from the group consisting of sulfur, sulfur donors, and mixtures thereof, where the curing agent is present in an amount of at least about 3% by weight of the compound;    the compound containing substantially no solvent.    
   
   
       2 . A compound according to  claim 1  wherein the curing agent is present in an amount between about 3% and about 10% by weight of the compound.  
   
   
       3 . A compound according to  claim 1  wherein the liquid isoprene rubber is present in an amount of at least about 40% by weight of the compound.  
   
   
       4 . A compound according to  claim 1  additionally comprising a solid isoprene rubber having a Mooney value of not more than about 75, wherein the solid isoprene rubber is present in an amount of not more than about 49% by weight of the total rubber.  
   
   
       5 . A compound according to  claim 1  which is readily flowable between about 23° C. and about 150° C.  
   
   
       6 . A flowable compound according to  claim 1  which can be curable at room or elevated temperature.  
   
   
       7 . A compound according to  claim 1  which is used as a curing material for a sealing member.  
   
   
       8 . A compound according to  claim 1  which is used as a curing material for a gasket selected from the group consisting of in place gasketing (CIPG), inject in place gasketing (IJPG), and form in place gasketing (FIPG).  
   
   
       9 . A compound according to  claim 1  which is used as a molding material selected from the group consisting of liquid injection molding (LIM), transfer molding (TM), and injection molding.  
   
   
       10 - 16 . (canceled)  
   
   
       17 . A compound according to claim  10  which is used as a curing material for a sealing member.  
   
   
       18 . A compound according to claim  10  which is used as a curing material for a gasket selected from the group consisting of in place gasketing (CIPG), inject in place gasketing (IJPG), and form in place gasketing (FIPG).  
   
   
       19 . A compound according to claim  10  which is used as a molding material selected from the group consisting of liquid injection molding (LIM), transfer molding (TM), and injection molding.  
   
   
       20 . (canceled)  
   
   
       21 . A sealing member made by a process comprising curing the solventless liquid isoprene compound according to  claim 1 .  
   
   
       22 . A sealing member according to  claim 21 , wherein the sealing member is a gasket.  
   
   
       23 . A gasket according to  claim 22 , wherein the gasket is a cure in place gasket (CIPG), an inject in place gasket (IJPG), or a form in place gasket (FIPG).  
   
   
       24 . A gasket according to  claim 22 , wherein the gasket is a gasket formed by liquid injection molding (LIM), a gasket formed by transfer molding (TM), or a gasket formed by injection molding.  
   
   
       25 . A sealing member according to  claim 21 , wherein the sealing member is an O-ring.  
   
   
       26 . A sealing member made by a process comprising curing the solventless liquid isoprene compound according to claim  10 .  
   
   
       27 . A sealing member according to  claim 26 , wherein the nonsulfur curing agent is a peroxide curing agent.  
   
   
       28 . A sealing member according to  claim 26 , wherein the sealing member is a gasket.  
   
   
       29 . A gasket according to  claim 28 , wherein the gasket is a cure in place gasket (CIPG), an inject in place gasket (IJPG), or a form in place gasket (FIPG).  
   
   
       30 . A gasket according to  claim 28 , wherein the gasket is a gasket formed by liquid injection molding (LIM), a gasket formed by transfer molding (TM), or a gasket formed by injection molding.  
   
   
       31 . A sealing member according to  claim 26 , wherein the sealing member is an O-ring.  
   
   
       32 . A process for making a sealing member, comprising shaping and curing the solventless liquid isoprene compound according to  claim 1 .  
   
   
       33 . A process according to  claim 32 , comprising shaping and curing by a method selected from the group consisting of cure in place gasketing (CIPG), inject in place gasketing (IJPG), and form in place gasketing (FIPG).  
   
   
       34 . A process according to  claim 32 , wherein the sealing member is shaped by a method selected from the group consisting of liquid injection molding (LIM), transfer molding (TM), and injection molding.  
   
   
       35 . A process according to  claim 32 , comprising curing at a temperature between 300° F. and 400° F.  
   
   
       36 . A process for making a sealing member comprising shaping and curing the solventless liquid isoprene compound according to claim  10 .  
   
   
       37 . A process according to  claim 36 , comprising shaping and curing by a method selected from the group consisting of cure in place gasketing (CIPG), inject in place gasketing (IJPG), and form in place gasketing (FIPG).  
   
   
       38 . A process according to  claim 36 , wherein the sealing member is shaped by a method selected from the group consisting of liquid injection molding (LIM), transfer molding (TM), and injection molding.  
   
   
       39 . A process according to  claim 36 , comprising curing at a temperature between 300° F. and 400° F.