US2008113141A1PendingUtilityA1

Pressure-sensitive adhesive tape or sheet, and method for producing it

Assignee: SANO MASANORIPriority: Apr 25, 2003Filed: Nov 14, 2007Published: May 15, 2008
Est. expiryApr 25, 2023(expired)· nominal 20-yr term from priority
Inventors:Masanori Sano
Y10T428/24182Y10T428/14Y10T428/24174Y10T428/2848Y10T428/1405Y10T428/1471C09J 2301/206C09J 7/38Y10T428/24322C09J 2301/302Y10T428/1476Y10T428/24802C09J 2301/18Y10T428/24008C09J 7/403Y10T428/1486
47
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Claims

Abstract

A pressure-sensitive adhesive tape or sheet having a pressure-sensitive adhesive layer formed on at least one surface of the support thereof, wherein the surface of the pressure-sensitive adhesive layer on at least one surface of the support partly has projected spots of fibers. The projected spots of fibers are preferably raised spots of fibers that are raised from the surface of the pressure-sensitive adhesive layer. The pressure-sensitive adhesive tape or sheet is favorable for flooring material fixation. The pressure-sensitive adhesive tape or sheet is produced according to a flocking method that comprises flocking the surface of the pressure-sensitive adhesive layer on at least one surface of the support to thereby form projected spots of fibers partly in the surface of the pressure-sensitive adhesive layer.

Claims

exact text as granted — not AI-modified
1 - 12 . (canceled) 
   
   
       13 . A releasable substrate of which at least one surface is a release face relative to a pressure-sensitive adhesive face and has holes, wherein the peripheral region around the holes is thickened, as swelling toward the side of one face alone. 
   
   
       14 . The releasable substrate as claimed in  claim 13 , which is formed of a plastic substrate. 
   
   
       15 . The releasable substrate as claimed in  claim 14 , wherein the holes are formed through perforation. 
   
   
       16 . The releasable substrate as claimed in  claim 15 , wherein the temperature for perforation is lower than the melting point of the plastic substrate and not lower than a temperature of (melting point −30° C.). 
   
   
       17 . The releasable substrate as claimed in  claim 13 , which is used in producing a pressure-sensitive adhesive tape or sheet that comprises a support, a pressure-sensitive adhesive layer formed on at least one surface of the support, and projected spots of fibers formed partly in the surface of the pressure-sensitive adhesive layer on at least one surface of the support. 
   
   
       18 . The releasable substrate as claimed in  claim 17 , wherein the holes are formed in the sites corresponding to the projected spots of fibers to be formed in the surface of the pressure-sensitive adhesive layer. 
   
   
       19 . A pressure-sensitive adhesive tape or sheet having a pressure-sensitive adhesive layer formed on at least one surface of the support thereof, and having projected spots of fibers formed partly in the surface of the pressure-sensitive adhesive layer on at least one surface of the support, which is produced by the use of the releasable substrate of  claim 13 . 
   
   
       20 . The pressure-sensitive adhesive tape or sheet as claimed in  claim 19 , wherein the projected spots of fibers are raised spots of fibers that are raised from the surface of the pressure-sensitive adhesive layer. 
   
   
       21 . The pressure-sensitive adhesive tape or sheet as claimed in  claim 19 , wherein the projected spots of fibers of the surface of the pressure-sensitive adhesive layer are so designed that they have a predetermined pattern as a whole. 
   
   
       22 . (canceled)

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