US2008107798A1PendingUtilityA1

Organic electroluminescent device

Assignee: 3M INNOVATIVE PROPERTIES COPriority: Sep 23, 2004Filed: Jan 11, 2008Published: May 8, 2008
Est. expirySep 23, 2024(expired)· nominal 20-yr term from priority
H10K 50/846H05B 33/04H05B 33/10H10K 50/844
55
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Claims

Abstract

An organic electroluminescent device comprises a substrate that supports a first electrode, a second electrode, and a light emitting structure that is disposed between the first and second electrodes. A protective structure comprising a layer of boron oxide and an inorganic barrier layer cooperates with the substrate to encapsulate the first electrode, the second electrode, and the light-emitting structure.

Claims

exact text as granted — not AI-modified
1 . A method of protecting an organic electroluminescent device against the absorption of moisture comprising: 
 a) providing an organic electroluminescent assembly comprising a low moisture permeable substrate that supports a first electrode, a second electrode, and a light emitting structure disposed between the first and second electrodes; and    b) applying a protective structure that cooperates with the substrate to encapsulate the first electrode, the second electrode, and the light emitting structure, wherein the protective structure comprises a layer of boron oxide and an inorganic barrier layer, wherein the inorganic barrier layer comprises a material different from the layer of boron oxide,    wherein the boron oxide layer functions to absorb moisture in order to reduce absorption of the moisture by the light emitting structure.    
     
     
         2 . A method according to  claim 1 , wherein the layer of boron oxide is applied by thermal evaporation.  
     
     
         3 . A method according to  claim 1 , wherein the inorganic barrier layer is applied by vapor deposition.  
     
     
         4 . A method according to  claim 1 , wherein the device additionally comprises a buffer layer between the organic electroluminescent assembly and the protective structure, and the buffer layer is applied by thermal evaporation.  
     
     
         5 . A method according to  claim 1 , wherein the inorganic barrier layer is laminated to the layer of boron oxide.

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