Printed circuit board including embedded chips and method of fabricating the same

Abstract

A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.

1 - 13 . (canceled)  
     
     
         14 . A printed circuit board having embedded chips, comprising the steps of: 
 a central layer having an embedded chip;    an insulating layer formed on at least one of an upper and a lower surface of the central layer and having a via hole filled with conductive ink; and    a circuit layer formed on the insulating layer having a via hole and a circuit pattern electrically connected to the embedded chip of the central layer through the via hole.    
     
     
         15 . The printed circuit board as set forth in  claim 14 , wherein the insulating layer comprises a cured resin layer and a non-cured resin layer.  
     
     
         16 . The printed circuit board as set forth in  claim 14 , wherein the chip comprises at least one of a passive component and an active component.