US2008106624A1PendingUtilityA1
Method of using a camera module
Est. expiryDec 8, 2019(expired)· nominal 20-yr term from priority
Inventors:Steven Webster
H10W 90/754H10W 90/734H10W 74/00H10W 72/07352H10W 72/884H10W 72/321H10W 72/0198H04N 23/54H04N 23/57H04N 23/55H10F 77/407H10F 77/50H10F 77/40H10F 39/8063H10F 39/811H10F 39/806H10F 39/804H10F 39/024H10F 39/011G02B 7/02Y10T29/49002G02B 7/022
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Claims
Abstract
An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.
Claims
exact text as granted — not AI-modified1 - 13 . (canceled)
14 . A method of using a camera module, the camera module comprising:
a substrate; an image sensor comprising an active area, the image sensor being coupled to a first surface of the substrate; a lens mount coupled to the substrate, the lens mount comprising a threaded aperture; a lens barrel comprising a threaded cylindrical surface, the lens barrel inserted into the threaded aperture of the lens mount, the lens barrel comprising an optical element; and a ball grid array for electrically connecting the camera module to a larger substrate, the method comprising: causing light to pass through the optical element and to contact the active area.
15 . The method of using a camera module of claim 14 further comprising mounting the camera module on a larger substrate.
16 . The method of using a camera module of claim 15 wherein the camera module is mounted to the larger substrate by the ball grid array.
17 . The method of using a camera module of claim 14 further comprising electrically connecting the camera module to a larger substrate.
18 . The method of using a camera module of claim 14 wherein the active area is responsive to the light.
19 . The method of using a camera module of claim 14 wherein the light comprises visible light.
20 . The method of using a camera module of claim 14 wherein the light comprises infrared radiation.
21 . The method of using a camera module of claim 14 wherein the light comprises ultraviolet light.
22 . The method of using a camera module of claim 14 further comprising focusing the light on the active area.
23 . The method of using a camera module of claim 22 wherein the focusing the light on the active area comprises moving the optical element relative to the image sensor.
24 . The method of using a camera module of claim 23 wherein the moving the optical element relative to the image sensor comprises moving the optical element away from the image sensor.
25 . The method of using a camera module of claim 23 wherein the moving the optical element relative to the image sensor comprises moving the optical element towards the image sensor.
26 . The method of using a camera module of claim 23 wherein the optical element comprises at least one lens.
27 . The method of using a camera module of claim 23 wherein rotation of the lens barrel moves the optical element relative to the image sensor.
28 . The method of using a camera module of claim 27 further comprising mounting the camera module on a larger substrate.
29 . The method of using a camera module of claim 28 wherein the focusing the light on the active area is performed prior to the mounting the camera module on a larger substrate.
30 . The method of using a camera module of claim 29 further comprising securing the lens barrel to the lens mount subsequent to the focusing the light on the active area.
31 . The method of using a camera module of claim 30 wherein the securing the lens barrel to the lens mount is performed prior to the mounting the camera module on a larger substrate.
32 . A method comprising:
coupling an image sensor to a first surface of a substrate, the image sensor comprising an active area; coupling bond pads of the image sensor to traces on the first surface of the substrate, the traces being electrically connected to interconnection balls coupled to a second surface of the substrate; coupling a lens mount to the substrate with an adhesive layer, the lens mount comprising a threaded aperture; inserting a lens barrel into the threaded aperture of the lens mount, the lens barrel comprising an optical element and a threaded cylindrical surface; and focusing light passing through the optical element on to the active area.
33 . A method comprising:
coupling an image sensor to a first surface of a substrate, the image sensor comprising an active area; coupling bond pads of the image sensor to traces on the first surface of the substrate, the traces being electrically connected to a means for electrically connecting coupled to a second surface of the substrate, the means for electrically connecting being selected from the group consisting of a ball grid array, a land grid array and a leadless chip carrier; coupling a lens mount to the substrate with an adhesive layer, the lens mount comprising a threaded aperture; inserting a lens barrel into the threaded aperture of the lens mount, the lens barrel comprising an optical element and a threaded cylindrical surface; and focusing light passing through the optical element on to the active area.Join the waitlist — get patent alerts
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