Circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof

Abstract

A circuitized substrate which includes a high temperature dielectric material in combination with a low temperature conductive paste, the paste including an organic binder component and at least one metallic component. The flakes of the metallic component are sintered to form a conductive path through the dielectric when the dielectric is used as a layer in the substrate.

1 . A multilayered circuitized substrate assembly comprising: 
 a first circuitized substrate including at least one high temperature dielectric layer having first and second opposing surfaces;    at least one opening within said at least one high temperature dielectric layer of said first circuitized substrate extending from said first opposing surface to said second opposing surface;    a quantity of low temperature conductive paste within said at least one opening within said at least one high temperature dielectric layer of said first circuitized substrate, said low temperature conductive paste including an organic binder component and at least one metallic component including a plurality of flakes, said flakes of said low temperature conductive paste being sintered and of such a density within said paste so as to form at least one electrical path through said paste from said first opposing surface to said second opposing surface of said at least one high temperature dielectric layer of said first circuitized substrate; and    a second circuitized substrate laminated to said first circuitized substrate, said first and second circuitized substrates forming a multilayered circuitized substrate assembly.    
     
     
         2 . The multilayered circuitized substrate assembly of  claim 1  wherein said at least one high temperature dielectric layer comprises a PTFE composite material.  
     
     
         3 . The multilayered circuitized substrate assembly of  claim 1  wherein said organic binder comprises a resin.  
     
     
         4 . The multilayered circuitized substrate assembly of  claim 3  wherein said resin comprises an anhydride epoxide.  
     
     
         5 . The multilayered circuitized substrate assembly of  claim 1  wherein said at least one metallic component is selected from a group of metallic components consisting of silver, copper and aluminum.  
     
     
         6 . A multilayered circuitized substrate assembly comprising: 
 a first circuitized substrate including at least one high temperature dielectric layer having first and second opposing surfaces;    at least one opening within said at least one high temperature dielectric layer extending from said first opposing surface to said second opposing surface;    a quantity of low temperature conductive paste within said at least one opening, said low temperature conductive paste including an organic binder component and at least one metallic component including a plurality of flakes, said flakes being sintered and of such a density within said paste so as to form at least one electrical path through said paste of said sintered flakes from said first opposing surface of said first circuitized substrate to said second opposing surface of said first circuitized substrate;    a second circuitized substrate laminated to said first circuitized substrate and also including at least one high temperature dielectric layer having first and second opposing surfaces and further including at least one conductive layer on said first opposing surface of said second circuitized substrate, said sintered flakes of said conductive paste being electrically coupled to said at least one conductive layer on said first opposing surface of said second circuitized substrate, said first and second circuitized substrates forming a multilayered circuitized substrate assembly.    
     
     
         7 . The multilayered circuitized substrate assembly of  claim 6  wherein said at least one high temperature dielectric layer of each of said first and second circuitized substrates comprises a PTFE composite material.  
     
     
         8 . The multilayered circuitized substrate assembly of  claim 6  wherein said organic binder comprises a resin.  
     
     
         9 . The multilayered circuitized substrate assembly of  claim 8  wherein said resin comprises an anhydride epoxide.  
     
     
         10 . The multilayered circuitized substrate assembly of  claim 6  wherein said at least one metallic component is selected from a group of metallic components consisting of silver, copper and aluminum.  
     
     
         11 . The multilayered circuitized substrate assembly of  claim 6  further including at least one electrical component electrically coupled to said second circuitized substrate.