Adhesive-backed articles

Abstract

Methods of preparing adhesive-backed articles and methods of applying adhesives backed articles are described. The adhesive-backed articles include a compliant film and a pressure-sensitive adhesive having a microstructured surface opposite the compliant film.

1 . A method of preparing an adhesive-backed article, said method comprising: 
 embossing a release liner to form a microstructured release liner;    coating a pressure-sensitive adhesive layer onto the microstructured release liner, wherein the pressure-sensitive adhesive layer has a microstructured surface facing the microstructured release liner; and    laminating a compliant film to a surface of the pressure-sensitive adhesive layer that is opposite the release liner,    wherein when the release liner is removed to expose the microstructure surface of the pressure-sensitive adhesive layer, said microstructure surface has channels that define exit pathways providing a continuous fluid egress to a periphery of said microstructured surface, said channels having a volume of at least 1×10 3  μm 3  per any 500 μm diameter circular area of the microstructured surface and having an aspect ratio of about 0.1 to about 20.    
   
   
       2 . The method of  claim 1 , wherein the channels have a cross-sectional form of v-grooves, u-grooves, rectangles, trapezoids, or combinations thereof.  
   
   
       3 . The method of  claim 1 , wherein the microstructured surface comprises a plurality of structures which at least partially define the channels.  
   
   
       4 . The method of  claim 3 , wherein the structures are selected from hemispheres, prisms, pyramids, ellipsoids, or a combination thereof.  
   
   
       5 . The method of  claim 3 , wherein the structures are truncated.  
   
   
       6 . The method of  claim 3 , wherein the structures are regularly placed about the microstructured surface of the pressure-sensitive adhesive.  
   
   
       7 . The method of  claim 3 , wherein the structures are randomly placed about the microstructured surface of said adhesive.  
   
   
       8 . The method of  claim 3 , wherein the structures are arranged at a pitch of about 400 μm or less.  
   
   
       9 . The method of  claim 3 , wherein the structures have a height of about 3 μm to about 50 μm.  
   
   
       10 . The method of  claim 1 , wherein the compliant film comprises a primer layer on a surface laminated to the pressure-sensitive adhesive layer.  
   
   
       11 . The method of  claim 1 , wherein the compliant film has a thickness of about 300 μm or less.  
   
   
       12 . The method of  claim 1 , wherein the release liner comprises a thermoplastic film.  
   
   
       13 . The method of  claim 1 , wherein the release liner comprises a paper laminated or coated with a thermoplastic material.  
   
   
       14 . The method of  claim 1 , wherein the release liner comprises a polyethylene coated paper.  
   
   
       15 . The method of  claim 1 , wherein the pressure-sensitive adhesive comprises a solvent based acrylic pressure-sensitive adhesive.  
   
   
       16 . A method of preparing an adhesive-backed article comprising: 
 providing a compliant film:    coating the compliant film with a pressure-sensitive adhesive layer;    embossing the pressure-sensitive adhesive layer to form to microstructured surface having channels that define exit pathways providing a continuous fluid egress to a periphery of said microstructured surface, said channels having a volume of at least 1×10 3  μm 3  per any 500 μm diameter circular area of the microstructured surface and having an aspect ratio of about 0.1 to about 20.