Method Of Extracting A Smart Card From A Smart Card Socket

Abstract

An improved smart card is provided, which is adapted for easy extraction from a smart card socket, or example, in a mobile telephone. Facilitating the easy extraction is a structural deviation in the plane of at least one of the sides of the smart card to enable an increase of an external force on the smart card to thereby cause the extraction of the smart card from a socket. The structural deviation may be a change in the thickness of the smart card or a roughened surface in the smart card's enclosure. The smart card may be a SIM card. Also provided is a method of extracting a smart card from a socket, which method may include the steps of engaging a structural deviation in the plane of at least one side of the smart card's enclosure and applying a force to the engaged structural deviation.

1 . A method of extracting a smart card from a smart card socket, the smart card having an enclosure complying with the ID-000 standard, the method comprising:
 a) engaging a structural deviation in the plane of at least one side of the enclosure; and   b) applying a force to said engaged structural deviation.   
   
   
       2 . The method according to  claim 1 , wherein said engaging a structural deviation includes rotating a handle about a living hinge. 
   
   
       3 . The method according to  claim 1 , wherein said applying a force to said structural deviation includes applying a shearing force. 
   
   
       4 . The method according to  claim 1 , further comprising:
 c) prior to said engaging a structural deviation, removably engaging a recess in said enclosure with an insert to provide a protrusion from said plane.