US2008101896A1PendingUtilityA1
System and method for vertical wafer handling in a process line
Est. expiryOct 31, 2026(~0.2 yrs left)· nominal 20-yr term from priority
H10P 72/15H10P 72/14
31
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Claims
Abstract
By orienting substrates in a substantially vertical manner during the transport of substrates in automatic wafer transport systems of complex manufacturing environments for processing microstructure devices, a significant reduction of floor space consumption in the respective clean room environment may be achieved. In particular, for large diameter substrates, a significant reduction of the lateral dimensions of the corresponding transport system may be obtained, while an even further enhancement in this respect may be obtained for process strategies using standard lots of reduced size.
Claims
exact text as granted — not AI-modified1 . A transport carrier for substrates for microstructure devices, comprising:
a body, said body comprising one or more compartments for receiving and supporting a substrate in a substantially vertical orientation relative to ground during transport.
2 . The transport carrier of claim 1 , further comprising a coupling mechanism configured to releasably connect said transport carrier with a conveyor of an automatic transport system.
3 . The transport carrier of claim 1 , wherein said one or more compartments are configured to receive a substrate having a diameter of approximately 200 mm.
4 . The transport carrier of claim 1 , wherein said one or more compartments are configured to receive a substrate having a diameter of approximately 300 mm.
5 . The transport carrier of claim 1 , wherein said one or more compartments are configured to receive a substrate having a diameter of approximately 450 mm.
6 . The transport carrier of claim 1 , wherein said transport carrier has a width dimension and a height dimension, said height dimension being substantially vertical when said transport carrier is in its transport orientation, wherein said width dimension is less than said height dimension.
7 . The transport carrier of claim 1 , wherein said transport carrier comprises at least two compartments, said at least two compartments being vertically stacked.
8 . The transport carrier of claim 1 , wherein said one or more compartments are further configured to support said wafer when said transport carrier is rotated to position said wafer in a substantially horizontal orientation.
9 . A load port system for a process tool of a manufacturing environment for processing substrates, said load port system comprising:
a carrier handling unit configured to receive a transport carrier including at least one compartment for supporting a substrate in a substantially vertical orientation relative to ground.
10 . The load port system of claim 9 , further comprising a substrate handling unit configured to access said at least one compartment when positioned in said substantially vertical orientation.
11 . The load port system of claim 9 , wherein said carrier handling unit is configured to rotate said transport carrier to position said at least one compartment in a substantially horizontal orientation.
12 . The load port system of claim 9 , wherein said carrier handling unit is configured to handle transport carriers containing substrates of 200 mm diameter.
13 . The load port system of claim 9 , wherein said carrier handling unit is configured to handle transport carriers containing substrates of 300 mm diameter.
14 . The load port system of claim 9 , wherein said carrier handling unit is configured to handle transport carriers containing substrates of 400 mm diameter.
15 . A method, comprising:
conveying a substrate to a process tool of a manufacturing environment for processing microstructure devices by an automated transport system, said substrate having a substantially vertical orientation relative to ground during transport.
16 . The method of claim 15 , wherein one or more further substrates are conveyed in a substantially vertical orientation concurrently with said substrate.
17 . The method of claim 16 , wherein at least one of said one or more further substrates is arranged horizontally adjacent to said substrate.
18 . The method of claim 16 , wherein at least one of said one or more further substrates is arranged vertically adjacent to said substrate.
19 . The method of claim 15 , wherein conveying said substrate comprises positioning said substrate in a transport carrier adapted to support said substrate in a substantially vertical transport orientation, and wherein said substrate is removed from said transport carrier by said process tool in the substantially vertical orientation.
20 . The method of claim 15 , further comprising receiving said substrate at said process tool, said substrate being contained in a transport carrier and rotating said transport carrier in said process tool so as to position said substrate into a substantially horizontal orientation.
21 . A system, comprising:
an automatic transport system configured to supply substrates; and a process tool configured to receive from said automatic transport system and to process substrates, said process tool receiving said substrates in a substantially vertical orientation relative to ground.Join the waitlist — get patent alerts
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