US2008099893A1PendingUtilityA1

Connecting a plurality of bond pads and/or inner leads with a single bond wire

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Assignee: MICROCHIP TECH INCPriority: Jul 31, 2002Filed: Dec 13, 2007Published: May 1, 2008
Est. expiryJul 31, 2022(expired)· nominal 20-yr term from priority
Inventors:Bruce BeauchampAndrew TuthillJoseph FernandezAnucha Phongsantichai
H10W 90/756H10W 90/753H10W 74/00H10W 72/07532H10W 72/5525H10W 72/5524H10W 72/5522H10W 72/5473H10W 72/5453H10W 72/5445H10W 72/952H10W 72/932H10W 72/59H10W 72/50H10W 72/90H10W 70/641H10W 70/611H10W 70/465H10W 90/811
45
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Claims

Abstract

An integrated circuit device comprising an integrated circuit die having a plurality of bond pads that are selectively connected to a plurality of inner leads of a leadframe. At least two bond pads are connected to at least one of the inner leads, and/or at least two inner leads are connected to at least one of bond pads with a single bond wire. A single bond wire is ball or wedge bonded to a first bond pad or inner lead and subsequently wedge bonded to one or more second bond pads or inner leads, then it is connected to a third or last bond pad or inner lead. The single bond wire requires only one connection area at each of the bond pad(s) and/or inner lead(s). The bond pad(s) of the die and/or inner lead(s) of the leadframe are thereby electrically connected together by the single bond wire.

Claims

exact text as granted — not AI-modified
1 . An integrated circuit device, comprising: 
 a leadframe having a plurality of inner leads;    an integrated circuit die having a plurality of bond pads; and    a single bond wire electrically coupling together at least two of the plurality of bond pads and at least one of the plurality of inner leads, wherein the single bond wire makes a first connection to a one of the at least two of the plurality of bond pads and a last connection to a one of the at least one of the plurality of inner leads such that the single bond wire is connected only once to each of the at least two of the plurality of bond pads and each of the at least one of the plurality of inner leads.    
     
     
         2 . The integrated circuit device of  claim 1 , wherein the first connection of the single bond wire is made with a ball bond and subsequent connections are made with wedge bonds.  
     
     
         3 . The integrated circuit device of  claim 1 , wherein the first and subsequent connections of the single bond wire are made with wedge bonds.  
     
     
         4 . The integrated circuit device of  claim 1 , further comprising an integrated circuit package encapsulating the plurality of inner leads of the leadframe, the integrated circuit die, the plurality of bond pads and the single bond wire.  
     
     
         5 . The integrated circuit device of  claim 1 , further comprising at least one re-route bond pad, wherein the single bond wire is connected to the at least one re-route bond pad between the first connection and the last connection thereof.  
     
     
         6 . An integrated circuit device, comprising: 
 a leadframe having a plurality of inner leads;    an integrated circuit die having a plurality of bond pads; and    a single bond wire electrically coupling together at least two of the plurality of bond pads and at least one of the plurality of inner leads, wherein the single bond wire makes a first connection to a one of the at least one of the plurality of inner leads and a last connection to a one of the at least two of the plurality of bond pads such that the single bond wire is connected only once to each of the at least one of the plurality of inner leads and each of the at least two of the plurality of bond pads.    
     
     
         7 . The integrated circuit device of  claim 6 , wherein the first connection of the single bond wire is made with a ball bond and subsequent connections are made with wedge bonds.  
     
     
         8 . The integrated circuit device of  claim 6 , wherein the first and subsequent connections of the single bond wire are made with wedge bonds.  
     
     
         9 . The integrated circuit device of  claim 6 , further comprising an integrated circuit package encapsulating the plurality of inner leads of the leadframe, the integrated circuit die, the plurality of bond pads and the single bond wire.  
     
     
         10 . The integrated circuit device of  claim 6 , further comprising at least one re-route bond pad, wherein the single bond wire is connected to the at least one re-route bond pad between the first connection and the last connection thereof.  
     
     
         11 . An integrated circuit device, comprising: 
 an integrated circuit die having a plurality of bond pads; and    a single bond wire electrically coupling together at least three of the plurality of bond pads, wherein the single bond wire makes a first connection to a first one of the at least three of the plurality of bond pads and a last connection to a last one of the at least three of the plurality of bond pads such that the single bond wire is connected only once to each of the at least three of the plurality of bond pads.    
     
     
         12 . The integrated circuit device of  claim 11 , wherein the first connection of the single bond wire is made with a ball bond and subsequent connections are made with wedge bonds.  
     
     
         13 . The integrated circuit device of  claim 11 , wherein the first and subsequent connections of the single bond wire are made with wedge bonds.  
     
     
         14 . The integrated circuit device of  claim 11 , further comprising an integrated circuit package encapsulating the integrated circuit die, the plurality of bond pads, and the single bond wire.  
     
     
         15 . The integrated circuit device of  claim 11 , wherein the single bond wire connection to the at least three of the plurality of bond pads determines an option configuration of the integrated circuit die.  
     
     
         16 . The integrated circuit device of  claim 11 , further comprising at least one re-route bond pad, wherein the single bond wire is connected to the at least one re-route bond pad between the first connection and the last connection thereof.  
     
     
         17 . An integrated circuit device, comprising: 
 a leadframe having a plurality of inner leads;    a first integrated circuit die having a first plurality of bond pads and at least one re-route bond pad;    a second integrated circuit die having a second plurality of bond pads; and    a single bond wire electrically coupling together at least one of the first plurality of bond pads, the at least one re-route bond pad and at least one of the second plurality of bond pads;    wherein the single bond wire makes a first connection to a first one of the at least one of the first plurality of bond pads, an intermediate connection to the at least one re-route bond pad and a last connection to a last one of the at least one of the second plurality of bond pads such that the single bond wire is connected only once to each of the at least one of the first plurality of bond pads, the at least one re-route bond pad and each of the at least one of the second plurality of bond pads.    
     
     
         18 . The integrated circuit device of  claim 17 , wherein the first connection of the single bond wire is made with a ball bond and subsequent connections are made with wedge bonds.  
     
     
         19 . The integrated circuit device of  claim 17 , wherein the first and subsequent connections of the single bond wire are made with wedge bonds.  
     
     
         20 . The integrated circuit device of  claim 17 , further comprising an integrated circuit package encapsulating the plurality of inner leads of the leadframe, the first and second integrated circuit dice, the plurality of first and second bond pads, the at least one re-route bond pad and the single bond wire.  
     
     
         21 - 36 . (canceled)

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