Method for sealing microcomponent

Abstract

A microcomponent on a substrate is sealed with a liquid silicone composition in the cured state by forming a channel or recess in a substrate, placing a microcomponent at the center of the channel-delimited region or recess, applying a droplet of liquid silicone composition so that the droplet is delimited by the perimeter of the channel or recess and held in a convex shape by the surface tension of the liquid, and curing the liquid silicone composition.

1 . In a method for sealing a microcomponent by covering a microcomponent resting on a substrate with a droplet of liquid silicone composition, and curing the liquid silicone composition for sealing the microcomponent onto the substrate, the improvement comprising the steps of: 
 forming a channel in an upper surface of the substrate so as to define and surround a predetermined region to be sealed with the cured liquid silicone composition, the channel having inner and outer walls,    placing the microcomponent at the center of said region, and    applying the droplet of liquid silicone composition over said region, the droplet of liquid silicone composition being delimited at the upper edge of the channel inner wall and held in a convex shape within said region so that the liquid silicone composition may not flow into the channel, by the surface tension of the liquid silicone composition, before the curing of the liquid silicone composition.    
     
     
         2 . In a method for sealing a microcomponent by covering a microcomponent resting on a substrate with a droplet of liquid silicone composition, and curing the liquid silicone composition for sealing the microcomponent onto the substrate, the improvement comprising the steps of: 
 forming a recess in a predetermined region of the substrate to be sealed with the cured liquid silicone composition, the recess having a circumferential wall,    placing the microcomponent at the center of said recess, and    applying the droplet of liquid silicone composition to said recess, the droplet of liquid silicone composition being delimited by the circumferential wall of the recess and held in a convex shape by the surface tension of the liquid silicone composition, before the curing of the liquid silicone composition.    
     
     
         3 . In a method for sealing a microcomponent by covering a microcomponent resting on a substrate with a droplet of liquid silicone composition, and curing the liquid silicone composition for sealing the microcomponent onto the substrate, the improvement comprising the steps of: 
 providing a weir of predetermined height on an upper surface of the substrate to define as a recess a predetermined region of the substrate to be sealed with the cured liquid silicone composition, the recess having a circumferential wall,    placing the microcomponent at the center of said recess, and    applying the droplet of liquid silicone composition to said recess, the droplet of liquid silicone composition being delimited by the circumferential wall of the recess and held in a convex shape by the surface tension of the liquid silicone composition, before the curing of the liquid silicone composition.    
     
     
         4 . The method of  claim 3 , wherein said weir is made of a solder resist, dam material or adhesive-bearing polymeric sheet.  
     
     
         5 . The method of  claim 1 , wherein the liquid silicone composition is a heat-curable liquid silicone composition.  
     
     
         6 . The method of  claim 1 , wherein the liquid silicone composition has a viscosity of up to 100 Pa-s.  
     
     
         7 . The method of  claim 1 , wherein the microcomponent comprises a semiconductor chip.  
     
     
         8 . The method of  claim 7 , wherein the semiconductor chip is a light-emitting diode.