US2008098750A1PendingUtilityA1

Thermoelectric cooling/heating device

Individually held — no corporate assignee on recordPriority: Oct 27, 2006Filed: Oct 27, 2006Published: May 1, 2008
Est. expiryOct 27, 2026(~0.2 yrs left)· nominal 20-yr term from priority
Inventors:Mark Busier
F24H 4/04F25B 2321/025F25B 21/04F25B 2321/0211F25B 2321/0212
37
PatentIndex Score
0
Cited by
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References
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Claims

Abstract

A device for heating or cooling air, has a housing with an inlet and an outer, as well as an inlet plenum and an outlet plenum for passing air through the housing. A heat sink defines a plurality of air passages between the inlet and outlet and fans in the housing move air through the inlet plenum, across the passages, into the outlet plenum. A plurality of Peltier modules in the housing each have one surface in heat transfer contact with the heat sink and an opposite surface in contact with a heat transfer circuit such as a flow or water in pipes, for cooling or heating the opposite surfaces. A purely relay-based, or PWM-based power circuit is connected to the modules for powering the modules and fans to cool or heat the heat sink.

Claims

exact text as granted — not AI-modified
1 . A device for heating or cooling air, comprising:
 an outer housing defining a volume, the housing having an outer inlet communicating with the volume for receiving air into the volume and an outer outlet spaced from the outer inlet and also communicating with the volume for discharging air from the volume;   an inner housing in the volume, the inner housing defining an inlet plenum therein and having an inner inlet for receiving air from the outer inlet and into the inlet plenum, the inner housing having an inner outlet spaced from the inner inlet;   the outer housing having an outlet plenum that is outside the inner housing and adjacent the inner outlet of the inner housing;   a heat sink in the inner housing, defining a plurality of air passages between the inner inlet and the inner outlet;   at least one fan mounted in the inner housing for moving air from the inner inlet to the inner outlet so that air moves from the outer inlet, through the inlet plenum, across the passages, into the outlet plenum and out through the outer outlet;   a plurality of spaced apart thermoelectric modules in the inner housing, each module having a first surface in heat transfer contact with the heat sink on a side of the heat sink that is opposite to the passages, and each module having an opposite surface;   a heat transfer circuit for receiving a heat transfer fluid from a location spaced away from the outer inlet and outer outlet, and for moving the heat transfer fluid past the opposite surfaces of the modules; and   a power circuit connected to the thermoelectric modules for powering the modules in a manner for one of cooling and heating the heat sink, the power circuit being connected to the fan for powering the fan to move air along the passages.   
   
   
       2 . A device according to  claim 1 , wherein the heat transfer circuit comprises a manifold for placing a flow of water in heat transfer contact with the opposite surfaces of the thermoelectric modules, a pump connected to the manifold for pumping water through the manifold and means for defining an inlet passage and an outlet passage for water to and from the pump and a body of water. 
   
   
       3 . A device according to  claim 1 , wherein the heat transfer circuit comprises a manifold for placing a flow of water in heat transfer contact with the opposite surfaces of the thermoelectric modules, a pump connected to the manifold for pumping water through the manifold and means for defining an inlet passage and an outlet passage for water to and from the pump and a radiator. 
   
   
       4 . A device according to  claim 1 , wherein the heat sink comprises a solid base and a plurality of fins extending from one side of the base for defining the plurality of air passages. 
   
   
       5 . A device according to  claim 1 , wherein the heat transfer circuit comprises a manifold for placing a flow of water in heat transfer contact with the opposite surfaces of the thermoelectric modules, a pump connected to the manifold for pumping water through the manifold and means for defining an inlet passage and an outlet passage for water to and from the pump and a body of water, the heat sink having a solid base and a plurality of fins extending from one side of the base and defining the plurality of air passages. 
   
   
       6 . A device according to  claim 1 , wherein the plurality of modules are separated into at least two module sets, the power circuit being connected to the modules for selectively powering one set only or both sets at one time. 
   
   
       7 . A device according to  claim 1 , wherein the plurality of modules are separated into at least two module sets, the power circuit including pulse width modulation means connected to the modules for selectively powering one set at a time. 
   
   
       8 . A device according to  claim 1 , including a cover plate connected over the heat transfer circuit and a bracket connected to a wall of the inner housing adjacent the fan, the power circuit being mounted to the bracket and having a plurality of control switches that are accessible through an opening in the outer housing that is over the bracket. 
   
   
       9 . A device according to  claim 1 , wherein the heat transfer circuit comprises a manifold for placing a flow of water in heat transfer contact with the opposite surfaces of the thermoelectric modules, a pump connected to the manifold for pumping water through the manifold and means for defining an inlet passage and an outlet passage for water to and from the pump and a radiator, and water heater means connected to the radiator for discharging a supply of warm water for use. 
   
   
       10 . A core device for heating or cooling air, comprising:
 a heat sink having a solid base and a plurality of fins extending from one side of the base and defining a plurality of air passages between an inlet on one end of the heat sink and an outlet on an opposite end of the heat sink;   at least one fan mounted for moving air from the inlet to the outlet so that air moves across the passages;   a plurality of thermoelectric modules each having a first surface in heat transfer contact with the heat sink on an opposite side of the base from the fins, the modules being spaced alone the base, parallel to the passages, and each module having an opposite surface;   a heat transfer circuit for receiving a heat transfer fluid from a location spaced away from the inlet and outlet, and for moving the heat transfer fluid past the opposite surfaces of the modules; and   a power circuit connected to the thermoelectric modules for powering the modules in a manner for one of cooling and heating the heat sink, the power circuit being connected to the fan for powering the fan to move air along the passages.   
   
   
       11 . A core device according to  claim 10 , wherein the heat transfer circuit comprises a manifold for placing a flow of water in heat transfer contact with the opposite surfaces of the thermoelectric modules, a pump connected to the manifold for pumping water through the manifold and means for defining an inlet passage and an outlet passage for water to and from the pump and a body of water. 
   
   
       12 . A core device according to  claim 10 , including a pair of mounting rails on opposite sides of the heat sink for mounting the heat sink to a support, the rails creating a clearance for the plurality of thermoelectric modules with the heat transfer circuit, and the support. 
   
   
       13 . A core device according to  claim 10 , wherein the heat transfer circuit comprises a manifold for placing a flow of water in heat transfer contact with the opposite surfaces of the thermoelectric modules, a pump connected to the manifold for pumping water through the manifold and means for defining an inlet passage and an outlet passage for water to and from the pump and a body of water. 
   
   
       14 . A core device according to  claim 10 , wherein the heat transfer circuit comprises a manifold for placing a flow of water in heat transfer contact with the opposite surfaces of the thermoelectric modules, a pump connected to the manifold for pumping water through the manifold and means for defining an inlet passage and an outlet passage for water to and from the pump and a radiator. 
   
   
       15 . A core device according to  claim 10 , wherein the plurality of modules are separated into at least two module sets, the power circuit being connected to the modules for selectively powering one set only or both sets at one time. 
   
   
       16 . A core device according to  claim 10 , wherein the plurality of modules are separated into at least two module sets, the power circuit including pulse width modulation means connected to the modules for selectively powering one set at a time. 
   
   
       17 . A core device according to  claim 10 , including a cover plate connected over the heat transfer circuit, an housing extending over the heat sink, the fan being mounted to the housing and a bracket connected to a wall of the housing adjacent the fan, the power circuit being mounted to the bracket and having a plurality of control switches. 
   
   
       18 . A core device according to  claim 10 , wherein the heat transfer circuit comprises a manifold for placing a flow of water in heat transfer contact with the opposite surfaces of the thermoelectric modules, a pump connected to the manifold for pumping water through the manifold and means for defining an inlet passage and an outlet passage for water to and from the pump and a radiator, and water heater means connected to the radiator for discharging a supply of warm water for use. 
   
   
       19 . A device for heating or cooling air, comprising:
 a fan for moving air;   a plurality of thermoelectric modules mounted for receiving a flow of air from the fan for cooling of heating the air; and   a power circuit connected to the thermoelectric modules for powering the modules in a manner for cooling or for heating the air, the power circuit being connected to the fan for powering the fan;   the power circuit comprising a fan speed controller for controlling the speed of the fan, a thermostat interrupting power to the fan and to the modules when a selected temperature is reached, and means for selectively powering the modules so that fewer than all the modules can be powered   
   
   
       20 . A core device according to  claim 19 , wherein the plurality of modules are separated into at least two module sets, the means for selectively powering the modules being connected to the modules for selectively powering one set only or both sets at one time. 
   
   
       21 . A core device according to  claim 19 , wherein the plurality of modules are separated into at least two module sets, the means for selectively powering the modules comprising pulse width modulation means connected to the modules for selectively powering one set at a time. 
   
   
       22 . A core device according to  claim 19 , including a heat transfer circuit comprising a manifold for placing a flow of water in heat transfer contact with surfaces of the thermoelectric modules, a pump connected to the manifold for pumping water through the manifold and means for defining an inlet passage and an outlet passage for water to and from the pump and a radiator, and water heater means connected to the radiator for discharging a supply of warm water for use.

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