Integrated circuit die/package interconnect

Abstract

A system may include a plurality of pliant conductive elements, a first end of one of the plurality of pliant conductive elements to be electrically coupled to a first electrical contact of an integrated circuit substrate and a second end of the one of the plurality of pliant conductive elements to be electrically coupled to a second electrical contact of an integrated circuit die.

1 - 8 . (canceled)  
     
     
         9 . A method comprising: 
 forming an integral conductive element, the integral conductive element defining a plurality of recesses;    depositing a first pliant material in the plurality of recesses to form a first structure;    removing portions of the integral conductive element to form a plurality of pliant conductive elements; and    depositing a second pliant material around the plurality of pliant conductive elements to form a second structure.    
     
     
         10 . A method according to  claim 9 , further comprising: 
 placing the first structure on a carrier after depositing the first pliant material; and    removing the second structure from the carrier after depositing the second pliant material.    
     
     
         11 . A method according to  claim 10 , wherein placing the first structure on a carrier comprises: 
 placing the first structure on a release layer disposed on a carrier, and    wherein removing the second structure from the carrier comprises:    releasing the second structure from the release layer.    
     
     
         12 . A method according to  claim 10 , further comprising: 
 bonding a first end of one of the plurality of pliant conductive elements to a first electrical contact of an integrated circuit substrate and a second end of the one of the plurality of pliant conductive elements to a second electrical contact of an integrated circuit die.    
     
     
         13 . A method according to  claim 10 , wherein depositing the second pliant material comprises: 
 depositing a second pliant material around the plurality of pliant conductive elements to form the second structure having a first side and a second side,    wherein the first side includes the first pliant material, the second pliant material and a plurality of first ends of a respective plurality of pliant conductive elements, and    wherein the second side includes the second pliant material and a plurality of second ends of the respective plurality of pliant conductive elements.    
     
     
         14 . A method comprising: 
 depositing a plurality of elements on a carrier, the plurality of elements comprising first pliant material;    depositing an integral conductive element on the plurality of elements;    removing portions of the integral conductive element to form a plurality of pliant conductive elements; and    depositing a second pliant material around the plurality of pliant conductive elements to form a first structure.    
     
     
         15 . A method according to  claim 14 , further comprising: 
 removing the first structure from the carrier after depositing the second pliant material.    
     
     
         16 . A method according to  claim 15 , wherein depositing the plurality of elements on the carrier comprises: 
 depositing the plurality of elements on a release layer disposed on the carrier, and    wherein removing the first structure from the carrier comprises:    releasing the first structure from the release layer.    
     
     
         17 . A method according to  claim 14 , further comprising: 
 bonding a first end of one of the plurality of pliant conductive elements to a first electrical contact of an integrated circuit substrate and a second end of the one of the plurality of pliant conductive elements to a second electrical contact of an integrated circuit die.    
     
     
         18 . A method according to  claim 14 , wherein depositing the second pliant material comprises: 
 depositing a second pliant material around the plurality of pliant conductive elements to form the second structure having a first side and a second side,    wherein the first side includes the first pliant material, the second pliant material and a plurality of first ends of a respective plurality of pliant conductive elements, and    wherein the second side includes the second pliant material and a plurality of second ends of the respective plurality of pliant conductive elements.    
     
     
         19 - 22 . (canceled)