MEM switching device and method for making same

Abstract

A MEM device and method for fabricating a MEM device. A MEM device comprising a lever mechanism residing along a substrate is disclosed. A contact material is deposited on a first surface of the lever mechanism. In one arrangement, the first surface is disposed towards the substrate. A first contact region may be deposited on the substrate. The first contact region attracts the lever mechanism towards the substrate such that the contact material becomes operationally coupled to a second contact region. The MEM device may also comprise a first anchor portion and a second anchor portion. The first and second anchor portions may be integral to a top surface of the substrate. Aspects of the invention are also particularly useful in providing an encapsulated MEM switching device.

1 . A MEM switching device comprising: 
 (a) a rib enforced lever mechanism residing along a surface of a substrate, said lever mechanism having at least one anchor lever mechanism portion extending from said surface;    (b) a first contact region deposited on said substrate, said first contact energized for attracting said lever mechanism towards said substrate such that said lever mechanism becomes electrically coupled to a third contact region; and    (c) a second contact region that pulls back said lever mechanism from being electrically coupled to said third contact region.    
   
   
       2 . The invention of  claim 1  wherein said rib enforced lever mechanism comprises a rib that is integral to said lever mechanism.  
   
   
       3 . The invention of  claim 2  wherein said rib comprises a conductive layer.  
   
   
       4 . The invention of  claim 2  wherein said conductive layer comprises Copper.  
   
   
       5 . The invention of  claim 3  wherein said conductive layer comprises Diamond.  
   
   
       6 . The invention of  claim 3  wherein said conductive layer comprises a conductive composition.  
   
   
       7 . The invention of  claim 1  wherein said switching device comprises a planarized surface.  
   
   
       8 . The invention of  claim 5  wherein said planarized surface is planarized by a Chemical Mechanical Planarization process.  
   
   
       9 . The invention of  claim 1  further comprising an integral enclosure, said integral enclosure used to enclose said MEM device.  
   
   
       10 . The invention of  claim 1  wherein said third contact region comprises a first and a second micro-strip line.  
   
   
       11 . A micro-machined structure for enclosing at least one MEM device, said structure comprising: 
 (a) a structure extending from a substrate and at least partially enclosing said at least one MEM device; and    (b) a cover structure residing on a portion of said substrate structure, wherein said micro-machined structure defines at least one tortuous path.    
   
   
       12 . The invention of  claim 11  wherein said tortuous path provides for a removal of material residing along said surface.  
   
   
       13 . The invention of  claim 11  further comprising a contact region, said contact region provided on said cover substrate structure, said contact region acting as a pull-back contact for a MEM device residing on said substrate.  
   
   
       14 . The invention of  claim 13  wherein said contact region comprises a shielding member, said shielding member preventing passage of electromagnetic radiation.  
   
   
       15 . A method of fabricating a micro-machined apparatus, said method comprising the steps of: 
 (a) providing a substrate;    (b) fabricating a substrate structure, said substrate structure extending from said substrate; and    (c) fabricating a cover substrate structure residing on a portion of said substrate structure, said cover structure defining at least one tortuous channel.