Systems and methods for orientation and direction-free cooling of devices

Abstract

A cooler includes a vessel enclosed with a body shell comprising a thermally conductive side; a liquid coolant at least partially filling the vessel; and an extended heat conducting structure having a boiling enhancement surface coupled to the thermally conductive side at a surface within the vessel.

1 . A cooler, comprising:
 a vessel enclosed with a body shell comprising a thermally conductive side;   a liquid coolant at least partially filling the vessel; and   an extended heat conducting structure having a boiling enhancement surface coupled to the thermally conductive side at a surface within the vessel.   
   
   
       2 . The cooler of  claim 1 , wherein the extended heat conducting structure comprises a column. 
   
   
       3 . The cooler of  claim 1 , wherein the column comprises one or more extrusions or posts each having the boiling enhancement surface in combination with the liquid coolant and at least a portion of the boiling enhancement surface contacts the liquid and evaporation occurs regardless of the orientation of the vessel. 
   
   
       4 . The cooler of  claim 1 , wherein the extended heat conducting structure comprises a pyramid. 
   
   
       5 . The cooler of  claim 1 , wherein the extended heat structure comprises one of: a sloped surface, a groove, a bump. 
   
   
       6 . The cooler of  claim 5 , wherein the sloped surface is higher toward a center of the structure and lower toward an edge of the structure. 
   
   
       7 . The structure of  claim 6 , wherein the liquid forms bubbles formed on the surface of the coating and wherein the bubble escapes toward top. 
   
   
       8 . The cooler of  claim 1 , wherein the body-shell of the vessel comprises one or more extended plate and one or more extruded fins. 
   
   
       9 . The cooler of  claim 1 , wherein the body-shell of the vessel at least partially comprises one of: plastic, vinyl, paper, molded and baked copper powder, electrically insulating and/or thermally conductive plastic. 
   
   
       10 . The cooler of  claim 1 , wherein the boiling enhancement surface coupled to the thermally conductive side on a surface within the vessel is at least partially submerged in the liquid coolant. 
   
   
       11 . The cooler of  claim 1 , wherein the boiling enhancement surface comprises a microporous surface structure insensitive to coating thickness, formed by combining a mixed cavity-generating particle batch and a thermally conductive binder. 
   
   
       12 . The cooler of  claim 11 , wherein the binder comprises one of: solder, silver, gold, metal binder, non-metal binder, epoxy. 
   
   
       13 . The cooler of  claim 1 , wherein the liquid coolant comprises water. 
   
   
       14 . The cooler of  claim 1 , wherein the liquid coolant comprises one of: a dielectric liquid, a non-dielectric liquid. 
   
   
       15 . A cooler to cool a heat generating device, comprising:
 a vessel enclosed with a body shell comprising a thermally conductive side, said vessel having a recessed portion to cover a volume of the heat generating device.   a liquid coolant at least partially filling the vessel; and   an extended heat conducting structure having a boiling enhancement surface coupled to the thermally conductive side at a surface within the vessel.   
   
   
       16 . The cooler of  claim 15 , wherein the recessed portion comprises vertical walls. 
   
   
       17 . The cooler of  claim 15 , wherein the recessed portion comprises angled walls. 
   
   
       18 . The cooler of  claim 15 , comprising an extended heat conducting structure. 
   
   
       19 . The cooler of  claim 18 , wherein the extended heat conducting structure comprises one or more extrusions or posts each having the boiling enhancement surface in combination with the liquid coolant and at least a portion of the boiling enhancement surface contacts the liquid and evaporation occurs regardless of the orientation of the vessel. 
   
   
       20 . The cooler of  claim 18 , wherein the extended heat conducting structure comprises a pyramid.