Cooling apparatus having an auxiliary chiller, and an apparatus and method of fabricating a semiconductor device using the same

Abstract

A cooling apparatus having an auxiliary chiller is provided. The apparatus can include a wafer chuck on which a wafer is mounted and in which a cooling cavity is formed. A main chiller having a main coolant reservoir can be spaced apart from the wafer chuck. The cooling cavity and the main coolant reservoir can be arranged in communication with each other through coolant passages. The coolant passages can include an auxiliary chiller detachably installed thereon, respectively. A method of cooling a wafer chuck or process chamber during a semiconductor device fabrication process is also provided. Using the method and apparatuses of this invention, fine temperature adjustments of the wafer chuck are possible.

1 . A cooling apparatus for use in a semiconductor device manufacturing process, said cooling apparatus comprising: 
 a wafer chuck on which a wafer is mounted, the wafer chuck having a cooling cavity formed therein;    a main chiller having a main coolant reservoir, the main chiller spaced apart from the wafer chuck;    coolant passages for communicating coolant between the cooling cavity and the main coolant reservoir; and    an auxiliary chiller detachably installed in communication with one or more of the coolant passages.    
   
   
       2 . The cooling apparatus according to  claim 1 , wherein the coolant passages comprise a first coolant supply line and a first coolant collecting line connected to the auxiliary chiller.  
   
   
       3 . The cooling apparatus according to  claim 2 , further comprising: 
 first and second coupling parts disposed on the first coolant supply line connected to the auxiliary chiller, wherein the first and second coupling parts include coupling lines connected to the first coolant supply line, a first switching valve and coupling nuts installed on the coupling lines; and    a second switching valve installed along the first coolant supply line and disposed between the first and second coupling parts.    
   
   
       4 . The cooling apparatus according to  claim 3 , further comprising: 
 a temperature sensor adapted to sense a temperature of the cooling cavity; and    a controller electrically connected to the temperature sensor, and the first and second switching valves,    wherein the controller operates the first and second switching valves in response to a temperature value transmitted to the controller from the temperature sensor.    
   
   
       5 . The cooling apparatus according to  claim 3 , wherein the auxiliary chiller comprises: 
 an auxiliary coolant reservoir;    second auxiliary coolant supply lines connected to the first and second coupling parts and extending from the auxiliary coolant reservoir;    first conductors disposed adjacent to the auxiliary coolant reservoir;    second conductors spaced apart from the first conductors;    semiconductors disposed between the first and second conductors and electrically connecting the first and second conductors; and    a first power source applied to the second conductors.    
   
   
       6 . The cooling apparatus according to  claim 5 , further comprising: 
 a cooling water circulation passage disposed adjacent to the second conductors; and    a cooling water supply reservoir in communication with the cooling water circulation passage.    
   
   
       7 . The cooling apparatus according to  claim 5 , further comprising heat radiation fins disposed adjacent to the second conductors.  
   
   
       8 . The cooling apparatus according to  claim 2 , further comprising a coolant heater installed on the first coolant collecting line.  
   
   
       9 . The cooling apparatus according to  claim 1 , wherein the main chiller comprises: 
 a first heat exchanger disposed adjacent to the main coolant reservoir;    first and second cooling medium passages connected to the first heat exchanger;    a second heat exchanger in communication with the first heat exchanger through the first and second cooling medium passages;    a compressor installed along the first cooling medium passage between the first and second heat exchangers; and    expansion valves disposed along the second cooling medium passage between the first and second heat exchangers.    
   
   
       10 . The cooling apparatus according to  claim 1 , wherein the main chiller comprises: 
 first conductors disposed adjacent to the main coolant reservoir;    second conductors spaced apart from the first conductors;    semiconductors disposed between the first and second conductors and electrically connecting the first and second conductors; and    a power source applied to the second conductors.    
   
   
       11 . An apparatus for fabricating a semiconductor device, comprising: 
 a main chiller;    a process chamber;    a process gas introduction port in communication with the process chamber;    a wafer chuck disposed in the process chamber, the wafer chuck including a cooling cavity formed therein;    a coolant supply line connecting the cooling cavity and the main chiller;    a coolant collecting line connecting the cooling cavity and the main chiller;    an auxiliary chiller detachably installed on the coolant supply line;    a process gas exhaust port in communication with the process chamber; and    a first power source electrically connected to the process chamber.    
   
   
       12 . The apparatus according to  claim 11 , further comprising: 
 first and second coupling parts included along the coolant supply line, wherein the first and second coupling parts are connected to the auxiliary chiller; and    a first switching valve arranged along the coolant supply line and disposed between the first and second coupling parts.    
   
   
       13 . The apparatus according to  claim 12 , wherein the first and second coupling parts comprise: 
 coupling lines connected to the coolant supply line; and    second switching valves and coupling nuts that are installed along the coupling lines.    
   
   
       14 . The apparatus according to  claim 13 , further comprising: 
 a temperature sensor that senses a temperature of the cooling cavity; and    a controller electrically connected to the temperature sensor and to the first and second switching valves,    wherein the controller operates the first and second switching valves in response to the temperature sensed by the temperature sensor.    
   
   
       15 . The apparatus according to  claim 12 , wherein the auxiliary chiller comprises 
 an auxiliary coolant cavity connected to the first and second coupling parts;    first conductors disposed adjacent to the auxiliary coolant cavity;    second conductors spaced apart from the first conductors;    first semiconductors disposed between the first and second conductors and electrically connecting the first and second conductors; and    a second power source connected to the second conductors.    
   
   
       16 . The apparatus according to  claim 15 , further comprising: 
 a cooling water circulation passage disposed adjacent to the second conductors; and    a cooling water supply reservoir arranged in communication with the cooling water circulation passage.    
   
   
       17 . The apparatus according to  claim 15 , further comprising heat radiation fins disposed adjacent to the second conductors.  
   
   
       18 . The apparatus according to  claim 12 , further comprising a coolant heater installed along the coolant collecting line.  
   
   
       19 . The apparatus according to  claim 11 , wherein the main chiller comprises: 
 a main coolant reservoir connected to the coolant supply line and the coolant collecting line;    a first heat exchanger disposed adjacent to the main coolant reservoir;    first and second cooling medium passages connected to the first heat exchanger;    a second heat exchanger in communication with the first heat exchanger through the first and second cooling medium passages;    a compressor included in the first cooling medium passage between the first and second heat exchangers; and    expansion valves included in the second cooling medium passage between the first and second heat exchangers.    
   
   
       20 . The apparatus according to  claim 19 , wherein the main chiller further comprises: 
 a second coolant reservoir connected to the coolant supply line and the coolant collecting line;    first conductors disposed adjacent to the second coolant reservoir;    second conductors spaced apart from the first conductors;    semiconductors disposed between the first and second conductors and electrically connecting the first and second conductors; and    a second power source applied to the second conductors.    
   
   
       21 . A method of cooling a wafer chuck during a manufacturing process for a semiconductor device, the method comprising: 
 setting a control temperature for a coolant;    cooling the coolant in a main chiller;    supplying the coolant cooled in the main chiller to a wafer chuck;    measuring a temperature of the coolant supplied to the wafer chuck;    comparing the measured temperature of the coolant with the control temperature;    stopping supply of the cooled coolant to the wafer chuck from the main chiller when the measured temperature is higher than the set temperature;    supplying the coolant cooled by the main chiller into an auxiliary chiller;    additionally cooling the coolant supplied into the auxiliary chiller; and    supplying the additionally cooled coolant from the auxiliary chiller to the wafer chuck.    
   
   
       22 . The method according to  claim 21 , further comprising: 
 collecting the coolant supplied to the wafer chuck before cooling the coolant in the main chiller; and    heating the collected coolant.    
   
   
       23 . The method according to  claim 21 , wherein the coolant supplied into the auxiliary chiller is additionally cooled by a thermo-electric cooler.  
   
   
       24 . The method according to  claim 21 , wherein the coolant in the main chiller is cooled by a mechanical cooler including a compressor for compressing a cooling medium, a condenser for condensing the compressed cooling medium, an expansion valve for expanding the condensed cooling medium, and an evaporator for evaporating the expanded cooling medium.