Adhesiveless Copper Clad Laminates And Method For Manufacturing Thereof

Abstract

The present invention provides adhesiveless copper clad laminates, which does not have defects on a copper film part due to a pin hole generated at the time of forming a base metal layer on an insulating film by dry plating process, has excellent adhesion between the insulating film and the base metal layer and corrosion resistance, and has a copper film layer having high insulation reliability, and provides a method for manufacturing such adhesiveless copper clad laminates. In adhesiveless copper clad laminates according to the present invention provided by forming a base metal layer directly at least on one plane of an insulating film without having an adhesive in between, and then by forming a copper film layer on the base metal layer, the base metal layer having a film thickness of 3 to 50 nm is formed by dry plating method and mainly contains a chrome-molybdenum-nickel alloy wherein the chrome ratio is 4 to 22 weight %, the molybdenum ratio is 5 to 40 weight %, and the balance is nickel.

1 . Adhesiveless copper clad laminates provided by forming a base metal layer directly formed at least on one plane of an insulating film without using an adhesive in between and then forming a copper film layer on the base metal layer, wherein the base metal layer is constituted of a base metal layer with a film thickness of 3 to 50 nm formed by a dry plating method, the base metal layer mainly containing a chrome-molybdenum-nickel alloy in which a chrome ratio is 4 to 22 weight %, a molybdenum ratio is 5 to 40 weight %, and the balance is nickel.  
     
     
         2 . The adhesiveless copper clad laminates according to  claim 1 , wherein the copper film layer formed on the base metal layer has a film thickness of 10 nm to 35 μm.  
     
     
         3 . The adhesiveless copper clad laminates according to  claim 1 , wherein the insulating film is a resin film selected from a polyimide-based film, a polyamide-based film, a polyester-based film, a polytetrafluoroethylene-based film, a polyphenylene sulfide-based film, a polyethylene naphthalate-based film, and a liquid crystal polymer-based film.  
     
     
         4 . A method for manufacturing adhesiveless copper clad laminates provided by forming a base metal layer directly at least on one plane of an insulating film without using an adhesive in between and then forming a copper film layer on the base metal layer, the method comprising: forming the base metal layer with a film thickness of 3 to 50 nm on the insulating film by a dry plating method, the base metal layer containing a chrome-molybdenum-nickel alloy in which a chrome ratio is 4 to 22 weight %, a molybdenum ratio is 5 to 40 weight %, and the balance is nickel; and forming the copper film layer on the base metal layer.  
     
     
         5 . The method according to  claim 4 , wherein the copper film layer is formed by the dry plating method, and then a copper film layer is further formed on the copper film layer by a wet plating method.  
     
     
         6 . The method according to  claim 4 , wherein the dry plating method is one of a vacuum deposition method, a sputtering method, and an ion plating method.