Printed Wiring Board for Mounting Electronic Components and Semiconductor Device Using Same

Abstract

A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via is connected with the wiring pattern and the other end portion is overlaid with a covering layer obtained by applying a conductive paste to cover at least the boundary between the filled via and the insulating layer; alternatively, a plating resist is formed at the other end portion to cover at least the boundary between the filled via and the insulating layer, and is removed after an end portion of the filled via enclosed within the plating resist is plated to produce a terminal layer, thereby preventing a wet processing liquid such as a tin plating solution from leaking in between the filled via and the insulating layer.

1 . A printed wiring board for mounting electronic components which comprises an insulating layer and a wiring pattern of a conductive metal that is formed on one surface of the insulating layer, wherein a through-hole perforating the insulating layer and the wiring pattern is filled with an implanting conductive material to form a filled via, one end portion of the filled via is connected with the wiring pattern, and the other end portion of the filled via is overlaid with a covering layer obtained by applying a conductive paste to cover at least the boundary between the filled via and the insulating layer.  
   
   
       2 . The printed wiring board according to  claim 1 , wherein a deposited coating layer by plating with a conductive metal is formed over the covering layer.  
   
   
       3 . The printed wiring board according to  claim 2 , wherein the deposited coating layer by the plating with the conductive metal is formed over an end portion of the filled via on the wiring pattern side to cover at least the boundary between the filled via and the wiring pattern.  
   
   
       4 . A printed wiring board for mounting electronic components which comprises an insulating layer and a wiring pattern of a conductive metal that is formed on one surface of the insulating layer, wherein a through-hole perforating the insulating layer and the wiring pattern is filled with an implanting conductive material to form a filled via, one end portion of the filled via is connected with the wiring pattern, and a deposited terminal layer obtained by applying a conductive paste to cover the boundary between the filled via insulating layer is formed on a central area of the other end portion of the filled via.  
   
   
       5 . The printed wiring board according to  claim 4 , wherein the deposited terminal layer is formed on a deposited coating layer formed by plating the central area of the end portion of the filled via.  
   
   
       6 . The printed wiring board according to  claim 5 , wherein the deposited coating layer by the plating is formed over an end portion of the filled via on the wiring pattern side to cover at least the boundary between the filled via and the wiring pattern.  
   
   
       7 . A semiconductor device fabricated using the printed wiring board of  claim 1 .  
   
   
       8 . The semiconductor device according to  claim 7 , wherein a semiconductor chip and/or a passive component is mounted on the reverse surface of the wiring pattern-formed surface.  
   
   
       9 . A semiconductor device fabricated using the printed wiring board of  claim 4 , wherein a semiconductor chip and/or a passive component is mounted on the reverse surface of the wiring pattern-formed surface, and wherein in the end portion of the filled via on the side where the semiconductor chip and/or the passive component is bonded, an outer periphery of the central area in which the deposited terminal layer is formed is coated with solder to cover at least the boundary between the filled via and the insulating layer.  
   
   
       10 . A semiconductor device fabricated using the printed wiring board of  claim 2 .  
   
   
       11 . A semiconductor device fabricated using the printed wiring board of  claim 3 .  
   
   
       12 . A semiconductor device fabricated using the printed wiring board of  claim 4 .  
   
   
       13 . A semiconductor device fabricated using the printed wiring board of  claim 5 .  
   
   
       14 . A semiconductor device fabricated using the printed wiring board of  claim 6 .  
   
   
       15 . A semiconductor device fabricated using the printed wiring board of  claim 5 , wherein one or both of a semiconductor chip and a passive component is mounted on the reverse surface of the wiring pattern-formed surface, and wherein in the end portion of the filled via on the side where one or both of the semiconductor chip and the passive component is bonded, an outer periphery of the central area in which the deposited terminal layer is formed is coated with solder to cover at least the boundary between the filled via and the insulating layer.  
   
   
       16 . A semiconductor device fabricated using the printed wiring board of  claim 6 , wherein one or both of a semiconductor chip and a passive component is mounted on the reverse surface of the wiring pattern-formed surface, and wherein in the end portion of the filled via on the side where one or both of the semiconductor chip and the passive component is bonded, an outer periphery of the central area in which the deposited terminal layer is formed is coated with solder to cover at least the boundary between the filled via and the insulating layer.