Resonator, ultrasonic die bonding head, and ultrasonic die bonding apparatus
Abstract
A resonator is disclosed that may includes a vibrating member holding an electronic component and applying a vibration to the electronic component, and a depressing member applying a depressing force for a side of a substrate to the electronic component through the vibrating member. The depressing member includes leg portions which are disposed so as to leave spaces between the leg portions and both side faces of the vibrating member parallel with a vibration direction, and supporting portions through which the leg portions and the side faces of the vibrating member are to be coupled to each other. With respect to a size of a cross section of each of the supporting portions parallel with the side face of the vibrating member, a length L 2 along the vibration direction A of the vibrating member is shorter than a length L 1 along a depressing direction B of the depressing member.
Claims
exact text as granted — not AI-modified1 . A resonator including:
a vibrating member, in order to join a second member to be joined to a first member to be joined, holding the second member to be joined and applying a vibration to the second member to be joined; and a depressing member applying a depressing force to the second device to be joined, which in-turn applies it to the side of the first member to be joined, through the vibrating member, wherein: the depressing member has: leg portions which are disposed so as to leave spaces between the leg portions and both side faces of the vibrating member parallel with a vibration direction; and supporting portions through which the leg portions and the side faces of the vibrating member are to be coupled to each other; each of the leg portions and the supporting portions is provided per one side face of the vibrating member by two or more; and with respect to a size of a section of each of the supporting portions parallel with the side face of the vibrating member, a length along the vibration direction of the vibrating member is shorter than that along a depressing direction of the depressing member.
2 . A resonator according to claim 1 , wherein each of the supporting portions is formed so as to have a rectangular configuration or an elliptic configuration in section.
3 . An ultrasonic bonding head, including at least:
a resonator including: a vibrating member, in order to join a second member to be joined to a first member to be joined, holding the second member to be joined and applying a vibration to the second member to be joined; and a depressing member applying a depressing force to the second member to be joined, which in-turn applies it to the side of the first member to joined, through the vibrating member, wherein the depressing member includes: leg portions which are disposed so as to leave spaces between the leg portions and both side faces of the vibrating member parallel with a vibration direction; and supporting portions through which the leg portions and the side faces of the vibrating member are to be coupled to each other, each of the leg portions and the supporting portions is provided per one side face of the vibrating member by two or more, and with respect to a size of a section of each of the supporting portions parallel with the side face of the vibrating member, a length along the vibration direction of the vibrating member is shorter than that along a depressing direction of the depressing member, the ultrasonic bonding head further including: an ultrasonic wave generating device for applying an ultrasonic wave to the vibrating member to cause the vibrating member to vibrate.
4 . An ultrasonic bonding apparatus, including at least:
a resonator including: a vibrating member, in order to join a second member to be joined to a first member to be joined, holding the second member to be joined and applying a vibration to the second member to be joined; and a depressing member applying a depressing force to the second member to be joined, which in-turn applies it to the side of the first member be joined, through the vibrating member, wherein the depressing member includes: leg portions which are disposed so as to leave spaces between the leg portions and both side faces of the vibrating member parallel with a vibration direction; and supporting portions through which the leg portions and the side faces of the vibrating member are to be coupled to each other, each of the leg portions and the supporting portions is provided per one side face of the vibrating member by two or more, and with respect to a size of a section of each of the supporting portions parallel with the side face of the vibrating member, a length along the vibration direction of the vibrating member is shorter than that along a depressing direction of the depressing member, the ultrasonic bonding apparatus further comprising: an ultrasonic bonding head including an ultrasonic wave generating device for applying an ultrasonic wave to the vibrating member to cause the vibrating member to vibrate; a pressurizing device for pressurizing the depressing member in the ultrasonic bonding head to a side of the vibrating member; a stage for supporting the first member to be joined; a stage moving portion for horizontally moving the stage in two directions intersecting perpendicularly to each other and for rotating the stage within a horizontal movement plane; and a position displacement detecting device for detecting position displacement between the first member to be joined placed on the stage and the second member to be joined supported by the ultrasonic bonding head.Join the waitlist — get patent alerts
Track US2008087708A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.