Carrier tape and method of wrapping semiconductor devices using the same

Abstract

Provided are a carrier tape and a method of wrapping semiconductor devices using the carrier tape. The carrier tape may include a frame tape having perforation portions, and a pocket having a recessed bottom on which the semiconductor device may be received. The stopper may prevent the semiconductor device received in the recessed bottom from escaping from the pocket. The stopper may be capable of being attached/detached into/from the perforation portion. The carrier tape may be recyclable to be more environmentally friendly. In addition, even if a defective portion is generated on the pocket, the corresponding portion may be more easily replaced with a new one. Thus, it may be economically advantageous to use the carrier tape.

1 . A carrier tape for receiving a semiconductor device, the carrier tape comprising:
 a frame tape including perforation portions; and   a pocket having a recessed bottom, and a stopper that retains the semiconductor device received in the pocket, wherein the pocket is capable of being attached/detached into/from the frame tape.   
   
   
       2 . The carrier tape of  claim 1 , wherein the pocket includes a pair of stoppers facing each other from opposite sides of an opening portion of the pocket. 
   
   
       3 . The carrier tape of  claim 1 , wherein the pocket is removably insertable into the perforation portions. 
   
   
       4 . The carrier tape of  claim 1  wherein the carrier tape is windable on a reel. 
   
   
       5 . The carrier tape of  claim 1 , wherein the pocket includes a lip portion parallel to the recessed bottom, the lip portion having a constant width on at least a portion of the opening portion of the pocket. 
   
   
       6 . The carrier tape of  claim 5 , wherein the pocket is removably insertable into the perforation portion of the frame tape, and the lip portion is mounted on a peripheral surface of the perforation portion of the frame tape. 
   
   
       7 . The carrier tape of  claim 1 , wherein the stopper is parallel to the recessed bottom, and the stopper is capable of rotating toward the recessed bottom and is incapable of moving toward in an opposite direction of the recessed bottom. 
   
   
       8 . The carrier tape of  claim 1 , wherein the pocket is removably insertable into the perforation portion of the frame tape, and the pocket includes a protrusion at least on a side surface of the pocket that prevents the pocket from escaping from the frame tape. 
   
   
       9 . The carrier tape of  claim 1 , wherein the perforation portions are uniform in size and the pockets have a non-uniform inner space to receive semiconductor devices of various sizes. 
   
   
       10 . The carrier tape of  claim 1 , wherein the pocket includes a lip portion around a periphery of an opening of the pocket. 
   
   
       11 . The carrier tape of  claim 1 , wherein the frame tape includes sprocket holes. 
   
   
       12 . The carrier tape of  claim 8 , wherein the protrusion is parallel to a lip portion that extends from the side surface of the pocket. 
   
   
       13 . The carrier tape of  claim 8 , wherein the protrusion is rounded. 
   
   
       14 . The carrier tape of  claim 1 , further comprising a cover tape covering an opening in the pocket. 
   
   
       15 . A method of wrapping semiconductor device using a carrier tape, including a frame tape having perforation portions; and a pocket having a recessed bottom and a stopper that retains the semiconductor in the pocket, the pocket capable of being attached/detached into/from the perforation portion, the method comprising:
 removably attaching the pocket into the frame tape; and   inserting the semiconductor device into the pocket.   
   
   
       16 . The method of  claim 15 , wherein the attaching of the pocket onto the frame tape includes:
 inserting the pocket into the perforation portion of the frame tape.   
   
   
       17 . The method of  claim 15 , further comprising removing the pocket from the frame tape. 
   
   
       18 . The method of  claim 17 , wherein the removing includes pressing opposing side surfaces of the pocket to separate the pocket from the frame tape. 
   
   
       19 . The method of  claim 17 , wherein the removing includes depressing protrusions that extend from side walls of the pocket.