Dryer Of Metal Molding System, Amongst Other Things

Abstract

Disclosed is: (i) a sub-system of a metal molding system, including (amongst other things) a conditioner, (ii) a metal molding system, including a conditioner, (iii) a metallic molded article manufactured by the use of a metal molding system having a conditioner, (iv) a method of a metal molding system, comprising conditioning, at least in part, metal chips, (v) a metallic molded article manufactured by the use of a method of a metal molding system, including conditioning, at least in part, metal chips, (vi) a molding material, including metal chips being conditioned, at least in part, (vii) a molten molding material, including a molten metallic melt being made from metal chips being conditioned, at least in part, and/or (viii) a metallic molded article, including a solidified molding material having been made from metal chips being conditioned, at least in part, amongst other things.

1 . A sub-system of a metal molding system, comprising:
 a conditioner positionable relative to the metal molding system, the conditioner configured to condition, at least in part, metal chips before the metal molding system processes the metal chips.   
     
     
         2 . The sub-system of  claim 1 , wherein:
 the conditioner includes a heater positionable relative to the metal molding system, the heater is configured to heat, at least in part, the metal chips.   
     
     
         3 . The sub-system of  claim 1 , wherein:
 the conditioner includes a heater positionable relative to the metal molding system, the heater is configured to heat, at least in part, the metal chips, the heater is operatively couplable to a hopper.   
     
     
         4 . The sub-system of  claim 1 , wherein:
 the conditioner includes a heater positionable relative to the metal molding system, the heater is configured to heat, at least in part, the metal chips, the heater is operatively couplable to a hopper, the hopper includes a mixer configured to mix the metal chips received in the hopper.   
     
     
         5 . The sub-system of  claim 1 , wherein:
 the conditioner includes:
 a heater positionable relative to the metal molding system, 
 the heater is configured to heat, at least in part, the metal chips; and 
   a dryer positionable relative to the metal molding system, the dryer is configured to dry, at least in part, the metal chips.   
     
     
         6 . The subsystem of  claim 1 , wherein:
 the conditioner includes a dryer positionable relative to the metal molding system, the dryer is configured to dry, at least in part, the metal chips.   
     
     
         7 . The sub-system of  claim 1 , wherein:
 the conditioner includes:
 a dryer positionable relative to the metal molding system, the dryer is configured to dry, at least in part, the metal chips, the dryer is operatively couplable to a hopper, the hopper includes a mixer configured to mix the metal chips received in the hopper. 
   
     
     
         8 . The sub-system of  claim 1 , wherein:
 the conditioner includes:
 a dryer, the dryer includes:
 a blower configured to blow air toward, at least in part, the metal chips, the blower includes:
 a pipe that is positionable, at least in part, at the metal chips, the air removing moister, at least in part, from the metal chips. 
 
 
   
     
     
         9 . The sub-system of  claim 1 , wherein:
 the conditioner includes:
 a dryer, the dryer includes:
 a blower configured to blow air toward, at least in part, the metal chips, the blower includes a pipe having a perforation configured to pass the air toward, at least in part, the metal chips. 
 
   
     
     
         10 . The sub-system of  claim 1 , wherein:
 the conditioner includes:
 a dryer, the dryer includes a blower configured to blow air toward, at least in part, the metal chips, the blower includes a pipe configured to direct the air upwardly toward, at least In part, through the metal chips. 
   
     
     
         11 . The sub-system of  claim 1 , wherein:
 the conditioner includes:
 a dryer, the dryer includes:
 a blower configured to blow air toward, at least in part, the metal chips, the blower including: (i) a pipe, and (ii) an aerating bubbler attached to the pipe. 
 
   
     
     
         12 . The sub-system of  claim 1 , wherein:
 the conditioner includes:
 a dryer, the dryer includes:
 a blower configured to blow dehumidified air, at least in part, toward the metal chips. 
 
   
     
     
         13 . The sub-system of  claim 1 , wherein:
 the conditioner includes:
 a dryer, the dryer includes:
 a blower configured to blow heated air, at least in part, toward the metal chips. 
 
   
     
     
         14 . The sub-system of  claim 1 , wherein:
 the metal chips are receivable in a hopper.   
     
     
         15 . The sub-system of  claim 1 , wherein:
 the metal chips are receivable in a hopper, the hopper is operatively couplable to an auxiliary hopper.   
     
     
         16 . The sub-system of  claim 1 , wherein:
 the metal chips are receivable in a hopper of the metal molding system, the hopper including: (i) an inlet configured to receive the metal chips, and (ii) an outlet configured to expel the metal chips to an extruder of the metal molding system.   
     
     
         17 . The sub-system of  claim 1 , wherein:
 the metal chips are receivable in a hopper of the metal molding system, the hopper being thermally insulated.   
     
     
         18 . A metal molding system, comprising:
 the sub-system of  claim 1 .   
     
     
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         36 . A method of a metal molding system, comprising:
 conditioning, at least in part, metal chips before the metal molding system processes the metal chips.   
     
     
         37 . The method of  claim 36 , further comprising any one of:
 heating, at least in part, the metal chips;   mixing the metal chips;   drying, at least in part, the metal chips;   removing moister, at least in part, from metal chips;   blowing aerated air toward the metal chips;   blowing dehumidified air, at least in part, toward the metal chips;   blowing heated air, at least in part, toward the metal chips; and   any combination and permutation thereof.   
     
     
         38 . (canceled) 
     
     
         39 . A molding material, comprising:
 metal chips being receivable by a metal molding system, the metal chips being conditioned, at least in part, by a conditioner before the metal molding system processes the metal chips, the conditioner positionable relative to the metal molding system.   
     
     
         40 . A molten molding material, comprising:
 a molten metallic melt being made from metal chips, the metal chips being receivable by a metal molding system, the metal chips being conditioned, at least in part, by a conditioner before the metal molding system processes the metal chips, the conditioner positionable relative to the metal molding system.   
     
     
         41 . A metallic molded article, comprising:
 a solidified molding material having been made from metal chips, the metal chips being receivable by a metal molding system, the metal chips being conditioned, at least in part, by a conditioner before the metal molding system processes the metal chips, the conditioner positionable relative to the metal molding system.