Microlens structure

Abstract

The present invention provides a microlens structure for a semiconductor device, including a substrate with at least a dielectric layer thereon, at least a micro bump positioned on the dielectric layer surface, and an optical film on the micro bump surface and dielectric layer surface, the micro bump and the optical film being the microlens.

1 . A microlens structure for a semiconductor device, comprising: 
 a substrate with at least a dielectric layer thereon;    at least a micro bump positioned on the dielectric layer surface; and    an optical film on the micro bump surface and dielectric layer surface, the micro bump and the optical film being the microlens.    
   
   
       2 . The microlens structure of  claim 1  wherein the substrate has at least a light sensitization device.  
   
   
       3 . The microlens structure of  claim 1  wherein the micro bump comprises a patterned first thin film, and a spacer around the patterned first thin film.  
   
   
       4 . The microlens structure of  claim 1  wherein the shape of the micro bump is a semicircle, rectangle, trapezoid, rectangle with round corners, or trapezoid with round corners.  
   
   
       5 . The microlens structure of  claim 1  wherein the refractive index of the micro bump is greater than that of the second thin film or equal to that of the optical film.  
   
   
       6 . The microlens structure of  claim 1  wherein the micro bump and the second thin film are the same dielectric material.  
   
   
       7 . The microlens structure of  claim 6  wherein the dielectric material comprises inorganic dielectric materials.  
   
   
       8 . The microlens structure of  claim 1  wherein the optical film comprises a color filter material or a dichroic film.  
   
   
       9 . The microlens structure of  claim 1  wherein the semiconductor device is a CMOS image sensor (CIS), and the substrate further has at least a photodiode corresponding to the microlens structure.